Edge Foundry Completes Cleanroom Expansion, Accelerates Mass Production of Thermal Imaging Sensors

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Edge Foundry is accelerating the establishment of a mass production system for its non-cooled thermal imaging camera module, 'Thermo K'.

The company completed the expansion of its production cleanroom in August, a project that began in June. Through this expansion, Edge Foundry plans to more than double its wafer production capacity compared to previous levels. Additionally, the company is sequentially introducing key equipment required for mass production.

The equipment to be introduced includes a WLVP Bonder (wafer-level packaging equipment that closely bonds sensor chips and protective wafers), Plating equipment (equipment that plates a thin metal layer on the wafer surface to enhance bonding strength and quality), and an Auto Wetstation (equipment that cleans and etches wafers with chemical solutions to remove impurities and smooth the surface). These machines completed inspection in July and are scheduled to be imported domestically during the third quarter of this year, after which they will be integrated into the production line starting in September.

Prior to full-scale mass production, Edge Foundry will supply approximately 200 initial units of 'Thermo K' to its clients. Through this, the company aims to validate performance in real-world environments and incorporate customer feedback.

An Edge Foundry representative stated, "The expansion of our production infrastructure and the introduction of new equipment are proceeding as scheduled," adding, "We will enhance product reliability and pursue global market expansion not only through domestic channels but also by participating in overseas exhibitions and conferences."

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