Participating in "electronica 2026" for four days
Targeting European customers in AI data centers, automotive electronics, and communications
Showcasing portfolio including PFCs and 5G antenna modules

Doosan is targeting the European market by showcasing high-end copper-clad laminates (CCLs) for artificial intelligence (AI) accelerators and optical modules at an electronics components and systems trade fair in Germany.

A view of Doosan Corporation's exhibition booth at electronica 2026, a trade fair for electronic components and systems, held in Munich, Germany, from the 10th to the 13th (local time). Doosan

A view of Doosan Corporation's exhibition booth at electronica 2026, a trade fair for electronic components and systems, held in Munich, Germany, from the 10th to the 13th (local time). Doosan

View original image

Doosan announced on November 11 that it will participate in electronica 2026, Europe's largest electronics components and systems trade fair, taking place in Munich, Germany, from November 10 to 13 (local time). About 3,500 companies from around 60 countries are expected to participate in this year's exhibition, which will be held alongside the semiconductor trade fair SEMICON Europa.


At the exhibition, Doosan will showcase electronic materials and components, including high-end CCLs used in AI data centers and servers, semiconductor packaging, automotive electronics, and 5G and 6G communications.


In particular, the company is highlighting CCLs used in AI accelerators and optical modules, key components of AI data centers. CCL is a core material for printed circuit boards (PCBs) and determines the performance and reliability of electronic products. Doosan's CCLs for AI accelerators and optical modules feature low dielectric constant and low dielectric loss, helping reduce signal loss during high-speed data transmission.


Doosan will also introduce patterned flat cables (PFCs) used in electric vehicle battery systems. PFCs connect the cells, the smallest units of an electric vehicle battery, and can reduce weight and volume by more than 80% compared with conventional copper wires. Doosan has developed technology to produce PFCs up to 2.5 meters long using the roll-to-roll process, a first in the world.


The company will also showcase a 5G antenna module featuring beamforming technology, which focuses signals in a specific direction. The product integrates signal transmission and reception with frequency conversion in a single unit.


A Doosan representative said, "This exhibition is an opportunity to show European customers Doosan's materials capabilities across everything from AI infrastructure to automotive electronics and communications. We will incorporate market trends and potential customers' requirements identified at the exhibition into our development process and do our utmost to secure new customers."



To meet growing demand for CCLs for AI semiconductors, Doosan is expanding its supply capacity by increasing production lines in Korea and establishing new production bases in Thailand and China.


This content was produced with the assistance of AI translation services.

© The Asia Business Daily. All rights reserved. Unauthorized AI training and use prohibited.

Today’s Briefing