SEC to Supply Micron with KRW 5.8 Billion in HBM X-Ray Inspection Equipment, Expanding Global Customer Base

SEC Co., Ltd., a specialist in inspection equipment based on electron beam (e-beam) source technology, will supply X-ray inspection equipment for high-bandwidth memory (HBM) to Micron, a global memory semiconductor company. As demand grows for nondestructive inspection to detect internal defects in semiconductors amid expanding HBM production capacity, SEC is broadening its supply base among global customers.

In a filing on November 10, SEC said it had signed a supply contract worth approximately KRW 5.8 billion with Micron's Singapore subsidiary for X-ray inspection equipment for HBM. Signed on November 6, the contract is equivalent to 9.84% of the company's revenue of KRW 59.2 billion in 2025. The equipment to be supplied is the NF120 series, a manual X-ray inspection system.

SEC has supplied inspection equipment to Micron's HBM mass-production lines since 2023. This additional order will expand its supply base among global customers. The company said that the use of manual equipment on actual mass-production lines demonstrates the growing importance of X-ray inspection in HBM manufacturing.

Increased capital expenditure (CAPEX) by global semiconductor companies is also cited as a factor driving growth in the inspection equipment market. Micron is investing approximately $7 billion to build an advanced HBM packaging facility in Singapore. The facility is expected to begin contributing substantially to expanded HBM production capacity in 2027. Micron also plans to increase future investment in facilities and manufacturing equipment, primarily for HBM and DRAM.

HBM has a structure in which multiple semiconductor chips are stacked vertically. As products become more highly integrated, inspection technology capable of precisely detecting internal defects becomes increasingly important. Unlike destructive inspection, which involves cutting a product open to examine its interior, X-ray inspection can observe internal structures without damaging the product. As production capacity expands and inspection becomes more automated, demand is also expected to grow for in-line X-ray equipment that inspects products in real time on production lines.

SEC is expanding its business from manual inspection equipment into automated in-line inspection systems. In October 2026, the company secured a contract to make its first supply of its self-developed Semi-scan Wafer to a wafer-level packaging (WLP) mass-production line operated by a global semiconductor outsourcing and test specialist (OSAT). Building on this, SEC is also pursuing entry into the market for in-line inspection equipment for HBM.

A SEC representative said, "This order from Micron Singapore is a significant example of the growing importance of X-ray inspection in HBM mass-production processes. We expect demand for precision inspection equipment to continue expanding as global semiconductor companies increase HBM production capacity and capital investment."

The representative added, "Building on our experience supplying the NF120 and our proprietary X-ray technology, we plan to expand the areas where Semi-scan is applied to HBM. In response to increased investment in global semiconductor facilities, we will develop our semiconductor inspection equipment business into a key growth driver."

This content was produced with the assistance of AI translation services.