Korean and U.S. Engineering Experts Discuss AI Semiconductor Design and Manufacturing Cooperation

First Korea-U.S. Advanced Engineering Forum to Be Held on Nov. 12; Cadence CEO to Deliver Keynote
Experts from Samsung Electronics and Intel to Participate; Focus on Advanced Packaging and Autonomous Semiconductor Manufacturing

Engineering experts from South Korea and the United States will discuss ways to cooperate on innovating semiconductor design and manufacturing through artificial intelligence (AI). Key topics will include advanced packaging, the development of autonomous semiconductor fabs, and the protection of critical manufacturing data.

The National Academy of Engineering of Korea said on November 6 that it will hold the first Korea-U.S. Advanced Engineering Forum online at 8 a.m. on November 12, in partnership with the U.S. National Academy of Engineering (NAE). The forum, the first jointly hosted by the two countries' engineering academies, will focus on "AI-Driven Innovation in Advanced Semiconductor Design and Manufacturing."

Tsu-Jae King Liu, president of the U.S. National Academy of Engineering (left), and Yoon Eui-joon, president of the National Academy of Engineering of Korea. Photo provided by the National Academy of Engineering of Korea.

Anirudh Devgan, CEO of Cadence Design Systems, will deliver the keynote address. Devgan will introduce next-generation design technologies that combine AI agents with physics-based simulation to optimize semiconductor chips, packaging, and systems as an integrated whole.

In the field of advanced packaging, presentations will be given by former Intel Executive Vice President Ann Kelleher and Young Chang Joo, a professor in the Department of Materials Science and Engineering at Seoul National University. Kelleher will discuss ways to improve semiconductor performance, manufacturing yields, and power efficiency, as well as address thermal management challenges, with a focus on 2.5D and 3D heterogeneous integration, hybrid bonding, and next-generation substrate technologies.

Professor Joo will explain the direction of advances in heterogeneous integration, which combines semiconductors with different functions into a single unit. He will present approaches to materials and manufacturing processes, as well as ways to ensure product reliability, that have become increasingly important as chiplets, high-bandwidth memory (HBM), and advanced packaging technologies have progressed.

Yongho Song, vice president and head of the AX/PI Center in Samsung Electronics' Device Solutions (DS) Division, will introduce AI-driven autonomous semiconductor manufacturing technologies. He will present ways to increase productivity and efficiency at semiconductor fabs by using digital twins to reproduce actual manufacturing processes in virtual environments, digital threads to connect data across the entire process, and AI agents.

In particular, he will propose a cooperation model in which companies exchange decision-making information between AI agents without directly sharing their critical manufacturing data. This approach would enable companies to expand their cooperation on AI technologies while protecting semiconductor manufacturing technologies and trade secrets.

Discussions on Protecting Manufacturing Data and Joint Research in Advanced Packaging

In the panel discussion that follows, keynote speaker and expert presenters will discuss cooperation between the two countries, moderated by Tsu-Jae King Liu, president of the U.S. National Academy of Engineering.

Key topics will include AI-driven semiconductor design technologies, intellectual property protection, training the next generation of talent, and removing technological barriers to developing smart fabs. In advanced packaging, participants will also discuss the thermal challenges of 2.5D and 3D integration and ways to jointly develop multiphysics simulation technologies.

The forum will open with welcoming remarks by Liu and Yoon Euijun, president of the National Academy of Engineering of Korea, and conclude with closing remarks by Lee Jung-bae, advisor to Samsung Electronics and chair of the Semiconductor Committee at the National Academy of Engineering of Korea.

The event will be held by online video conference, and anyone can attend by registering in advance.

This content was produced with the assistance of AI translation services.