Dongjin Semichem: "Supplying EUV Photoresist... Developing Advanced Packaging Materials"

Narrowing Technology Gap with Japanese Competitors... Pursuing Expanded Domestic Supply
Developing RDL Insulating Materials and Build-Up Films... Customer Evaluations Underway

Domestic semiconductor materials company Dongjin Semichem is supplying photoresist (PR) for extreme ultraviolet (EUV) processes to customers and is accelerating the development of advanced semiconductor packaging materials. After building technological capabilities in front-end materials used to form semiconductor circuits, the company is expanding its business into packaging materials needed for high-performance semiconductors such as high-bandwidth memory (HBM).

Kim Hyeonjin, head of the Support Group in Dongjin Semichem's Semiconductor Materials Business Division (executive director), said on October 29 at the Press Day for the Korean Society of Industrial and Engineering Chemistry's 2026 Fall Meeting at BEXCO in Busan, in response to a question about the level of localization of semiconductor materials: "We have also developed photoresist for EUV and are currently supplying it to customers." He added, "We believe we have substantially narrowed the technology gap with Japanese competitors and are now close to their level."

Kim Hyeonjin, head of the Support Group in Dongjin Semichem's Semiconductor Materials Business Division (executive director, left), and Jeong Hakgi, an electronics materials research fellow at Dongjin Semichem, answer reporters' questions at the Press Day for the Korean Society of Industrial and Engineering Chemistry's 2026 Fall Meeting at BEXCO in Busan on the 29th. Provided by the Korea Science Journalists Association.

EUV PR is a key material used in the lithography process to form fine patterns in advanced semiconductor circuits. Japanese companies have maintained a high level of technological competitiveness in this field for many years, and expanding supply by domestic materials companies is considered a key challenge in localizing semiconductor materials.

Dongjin Semichem said that although its market share in advanced products has yet to reach 30%, it is gradually increasing supply in the domestic market.

Advanced packaging materials are a new area Dongjin Semichem is targeting. High-performance semiconductors, including HBM, require a range of materials for wiring, insulation, and joint protection as multiple chips are connected or stacked. Japanese companies are considered to have strong market dominance in these materials.

Asked whether it was already supplying any materials for advanced packaging, Executive Director Kim replied, "We are not yet supplying any materials to companies," adding, "However, we are conducting evaluations closely with customers."

Developing Redistribution Layers and Build-Up Films, While Preparing Next-Generation EUV Materials

The materials Dongjin Semichem is prioritizing for development are photosensitive insulating materials (PID) used to form redistribution layers (RDL) and build-up films. Redistribution layers are wiring structures that reconfigure electrical connections between semiconductor chips, while build-up films are used to insulate wiring layers in packaging substrates.

Dongjin Semichem's semiconductor materials production facility in Hwaseong, Gyeonggi Province. The company supplies photoresists for extreme ultraviolet (EUV) processes to customers and is also developing advanced packaging materials. Provided by the Ministry of Trade, Industry and Energy.

Jeong Hakgi, an electronics materials research fellow at Dongjin Semichem, said, "The RDL materials we are currently focusing on are used to form wiring." He added, "While prioritizing the development of build-up films, we are also assessing other packaging materials, including underfill."

Japanese companies have particularly strong influence in the build-up film field. The company said that a certain Japanese company holds more than 95% of the global market.

The company is also developing materials to meet the needs of next-generation EUV processes. Dongjin Semichem is continuously improving the performance of its existing EUV materials while preparing new materials in anticipation of the introduction of high-numerical-aperture (High-NA) EUV equipment.

Research Fellow Jeong said, "When High-NA EUV equipment is introduced, some materials will also need to change, so we are preparing for that." He added, "We are responding by continuing to upgrade and improve our materials for EUV processes."

Meanwhile, Dongjin Semichem plans to sponsor the Korean Society of Industrial and Engineering Chemistry's program inviting Nobel Prize laureates every year, starting this year.

This content was produced with the assistance of AI translation services.