SK hynix said, "Current customer demand for HBM is more than twice the volume we can supply."


A SK hynix official made the remarks during the company’s third-quarter 2026 earnings conference call on the 28th, saying that the medium- to long-term demand outlook remained unchanged despite the possibility of reducing the number of HBM stack layers.


SK hynix's HBM (high-bandwidth memory) is on display at the 28th Semiconductor Exhibition, held at COEX in Gangnam-gu, Seoul, on the 14th. Photo by Kang Jinhyeong.

SK hynix's HBM (high-bandwidth memory) is on display at the 28th Semiconductor Exhibition, held at COEX in Gangnam-gu, Seoul, on the 14th. Photo by Kang Jinhyeong.

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"The move to lower HBM specifications is a clear example of demand outpacing supply," he said. "We see it as a strategy to increase the number of cubes that can be secured at the same capacity by reducing the number of stack layers."



He also stressed that there would be no impact on the supply side. "For the same bit volume, supplying HBM with fewer stack layers requires more cubes, which in turn increases demand for base dies and back-end processes," he said. "We have incorporated this into our production and supply plans, and the shipment and supply schedules for the HBM we are currently supplying are expected to proceed without disruption."


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