Samsung Exynos 2700 Beats Qualcomm's Latest Flagship

20% Ahead in Benchmark Performance

Samsung Electronics' in-house mobile application processor (AP), the Exynos 2700, which is expected to power the Galaxy S27 series of flagship smartphones slated for release early next year, has reportedly significantly outperformed the latest flagship chipset from rival Qualcomm.

According to industry sources on October 25, the Exynos 2700 scored higher across both central processing unit (CPU) and graphics processing unit (GPU) performance than Qualcomm's top-tier processor, the Snapdragon 8 Elite Extreme 6th Generation, in recent benchmark tests using Xiaomi's Xiaomi 18 Pro Max smartphone.

Qualcomm previously unveiled its next-generation AP lineup, consisting of the top-tier Extreme model and the entry-level Snapdragon 8 Elite 6th Generation. The two chipsets are featured in the Xiaomi 18 Pro Max and Xiaomi 18 Pro, respectively.

In performance tests using the Xiaomi 18 Pro Max, Samsung Electronics' Exynos 2700 scored about 13,000 points in the CPU multicore test on Geekbench 6.5, roughly 20% more than Qualcomm's Extreme model, which scored about 11,000 points. It also had an approximately 15% lead in the multicore test on Geekbench 7.0. Compared with the lower-tier Snapdragon 8 Elite 6th Generation, the Exynos 2700 scored 44% and 36% higher, respectively, under the same benchmarks.

The Exynos 2700 also stood out in GPU performance. In a peak processing performance test under demanding gaming conditions using the latest graphics technology, it scored about 20% higher than Qualcomm's Extreme model. It also outperformed the model by about 5% in a test measuring basic 3D graphics processing capability.

The Exynos series consists of mobile APs designed by Samsung Electronics' System LSI Business and serves as the brain of its smartphones. Its predecessor, the Exynos 2600, was featured in some models in Samsung Electronics' Galaxy S26 series and in the Galaxy Z Flip8. The Exynos 2700 is expected to be mass-produced using Samsung Electronics' Foundry Business's second-generation 2-nanometer process (SF2P). It is also reported to use an upgraded Heat Path Block (HPB) packaging technology to reduce heat and improve performance.

Samsung Electronics' headquarters in Yeongtong-gu, Suwon, Gyeonggi Province. Yonhap News.

This content was produced with the assistance of AI translation services.