Hyundai Mobis Eyes Expanding Automotive Semiconductor Technology into Robotics... Reviews Motor and Power Chip Development

Second Auto Semicon Korea Forum Held
Focus on Technological Overlap Between Automotive and Robotics Semiconductors

Hyundai Mobis is considering ways to expand its automotive semiconductor technology into the robotics sector. The company plans to apply its motor control and power management technologies, developed through its work on automotive semiconductors, to robotics semiconductors and broaden the scope of their use in future mobility.

Park Cheolhong, executive vice president in charge of the semiconductor business at Hyundai Mobis, said at the second Auto Semicon Korea forum on automotive semiconductors, held in Seongnam, Gyeonggi Province, on October 21, 2026: "We are pursuing a business in robotic actuators and are currently reviewing the development of motors, a key component, as well as power semiconductors."

Park Cheolhong, executive vice president in charge of the semiconductor business at Hyundai Mobis, speaks at the second Automotive Semiconductor Forum, "Auto Semicon Korea," held in Seongnam, Gyeonggi Province, on the 21st.

Hyundai Mobis is focusing on the technological overlap between automotive and robotics semiconductors. Technologies for current sensing and position and speed control, which are required for motor-drive semiconductors, can also be used in automotive semiconductors.

"Motor-drive semiconductors for robots use technologies such as current sensing, position control and speed control that are also used in automotive semiconductors," Park said. "With the addition of designs for high-precision control, it is possible to transition from automotive semiconductors to robotics semiconductors."

He also identified power semiconductors as an area where the technology could be adapted. "Circuit design and inductor current control technologies are very similar to those used in automotive semiconductors," Park said. "By adding designs for low-power implementation, we can adapt and develop semiconductors optimized for robots."

Hyundai Mobis plans to use its experience developing automotive semiconductors to improve the efficiency of robotics semiconductor development and lay the groundwork for cooperation with domestic semiconductor companies.

"We will carefully review the specifications for robotics semiconductors and work with excellent companies in the domestic ecosystem to efficiently develop specialized specifications," Park said. However, the project is still at the review stage, and the investment size, development schedule and mass-production plans have not been disclosed.

Auto Semicon Korea is a collaboration platform launched by Hyundai Mobis in 2025 to connect capabilities across the automotive and semiconductor industries, including automakers, parts suppliers, fabless companies, foundries and design houses, and to strengthen the competitiveness and supply-chain foundation of Korea's automotive semiconductor industry.

More than 90 people attended, including Hyundai Mobis President Lee Gyu-seok, Minister of Trade, Industry and Energy Kim Jung-kwan, senior executives and other leaders from major companies, as well as government, academic and association representatives. In addition to the 27 companies and organizations that participated in 2025, including Samsung Electronics, SK keyfoundry, Global Technology, ABOV Semiconductor, LX Semicon and Dongwoon Anatech, the platform expanded its collaboration this year to include areas such as IP (intellectual property), testing and evaluation, and functional safety, bringing the total number of participating companies and organizations to 53.

This content was produced with the assistance of AI translation services.