T-Robotics Secures U.S. Patent for Semiconductor Glass-Substrate Transfer Robot, Targets Advanced Packaging

T-Robotics is expanding its robotics business for next-generation semiconductor processes after securing a U.S. patent for its technology for robots that transfer semiconductor glass substrates. Having secured rights to the technology in the United States, following Korea and Japan, the company has broadened its intellectual property protection across major semiconductor markets.

T-Robotics, a company specializing in humanoid and industrial robots, said on October 21 that it had completed the registration of a U.S. patent for technology related to robots that transfer semiconductor glass substrates.

The patent covers technology for equipment that precisely transfers semiconductor substrates inside a vacuum chamber. T-Robotics is expanding the application of technologies it accumulated while developing and supplying vacuum robots for displays to the field of semiconductor glass-substrate transfer.

In particular, the company is preparing to enter the next-generation semiconductor packaging market, drawing on its precision-control and vacuum-transfer technologies for large substrates, developed in the course of creating robots to transfer 8.6th-generation organic light-emitting diode (OLED) substrates. Its strategy is to broaden the application of its technologies to robots for semiconductor processes by combining its experience in reliably transporting large substrates with its domestic and international patents.

Semiconductor glass substrates have attracted attention as a next-generation advanced packaging material amid growing demand for artificial intelligence (AI) semiconductors and high-bandwidth memory (HBM). Compared with conventional organic substrates, they offer advantages such as greater flatness and thermal stability, making them suitable for high-performance semiconductor packaging.

Accordingly, demand is also expected to grow for robots and automation technologies that can transfer glass substrates precisely and reliably during manufacturing. T-Robotics plans to address this market by leveraging the vacuum-transfer technology it has accumulated in the display sector.

T-Robotics previously completed patent registrations for related technologies in Korea and Japan. With the addition of the U.S. patent, the company has strengthened the protection of its core technologies in major semiconductor markets.

The company is pursuing patent applications for related technologies in China and Taiwan. It plans to expand its patent portfolio in major semiconductor-producing countries and identify new business opportunities with global semiconductor manufacturers and equipment makers.

A T-Robotics representative said, "As the AI semiconductor and advanced packaging markets grow, the importance of high-precision substrate-transfer technology is increasing. We will actively respond to the technology needs of global semiconductor manufacturers and equipment makers and move forward in earnest with the commercialization of robots for next-generation semiconductor processes."

This content was produced with the assistance of AI translation services.