OTEC Carrier Selected as Preferred Negotiator to Supply Cooling Equipment for 200-MW Gumi AI Data Center

OTEC Carrier is entering the market for supplying cooling equipment for large-scale AI data centers with capacities of 200 MW. Having secured a supply opportunity for a 200 MW project following an existing 48 MW hyperscale data center project, the company is stepping up its efforts to capture a greater share of South Korea's AI data center cooling market.

OTEC Carrier, an affiliate of OTEC Group, announced on October 14 that it had been selected on October 8 as the preferred negotiating party to supply cooling equipment for the Gumi AI Cluster Data Center Development Project, which is being developed in Gumi, North Gyeongsang Province.

The project involves building a hyperscale data center with an IT capacity of 200 MW, optimized for workloads based on NVIDIA's next-generation AI computing platform, Rubin.

Once a final contract is signed, OTEC Carrier plans to supply 160 units of Carrier Global's high-efficiency, air-cooled inverter screw chiller, the AquaForce® 30XFZ. This would be the largest chiller supply project OTEC Carrier has undertaken to date, measured by a single project.

The 30XFZ is an air-cooled inverter chiller that uses Carrier Global's high-efficiency cooling technology. It uses an environmentally friendly HFO refrigerant and can save up to 50% in energy through free-cooling operation during seasonal transitions. It is designed to reach 100% load within 120 seconds, even after a power outage.

An intelligent control system will also be used to support the stable operation of the cooling equipment. Carrier's SmartVu™ system enables real-time monitoring of the equipment's operating status and efficient control. The system is designed to enhance the reliability of AI data centers, which require stable cooling around the clock.

As the generative AI and high-performance computing (HPC) markets expand rapidly, power density and heat generation inside data centers are also increasing. As a result, cooling infrastructure that can reduce power consumption while delivering high cooling performance and reliability is emerging as a key factor in data center construction.

OTEC Carrier is also expanding its business to meet demand for cooling at large-scale data centers. It is strengthening its integrated cooling solutions by combining high-capacity, high-efficiency chillers with liquid cooling solutions such as Coolant Distribution Units (CDUs), free-cooling technology, and BluEdge™, an AI-based facility management service.

The company is also building its technological competitiveness in liquid cooling for next-generation AI data centers. Recently, Carrier Global's 1.3 MW CDU, the 65LL, was listed as a "Product Qualified" product on the NVIDIA Marketplace, demonstrating its capabilities in AI data center cooling technology.

OTEC Carrier plans to expand cooling equipment supplies, particularly for large-scale hyperscale data centers, including the Gumi project, and build a business portfolio spanning chillers and liquid cooling technology.

OTEC Carrier Chairman Kang Sunghee said, "This Gumi AI data center project is significant because it involves pursuing the largest chiller supply contract we have ever undertaken for a single project. Building on Carrier Global's advanced cooling technology and OTEC Carrier's project execution capabilities, we will provide integrated solutions ranging from high-efficiency chillers to liquid cooling and accelerate our efforts to capture a greater share of South Korea's AI data center market."

This content was produced with the assistance of AI translation services.