Samsung Electronics Unveils HBM4E and 'Yongin National Industrial Complex' Vision at SEDEX

Six zones, including next-generation technologies, cloud AI and physical AI

Showcases integrated AI semiconductor capabilities

Unveils roadmap for 360 trillion won Yongin National Industrial Complex

Samsung Electronics will participate in SEDEX 2026, the country’s largest semiconductor exhibition, presenting integrated artificial intelligence (AI) semiconductor solutions spanning memory, foundry and advanced packaging. At the same time, it will unveil a detailed roadmap for the Yongin Advanced System Semiconductor National Industrial Complex (Yongin National Industrial Complex), which will receive a total investment of KRW 360 trillion, as it seeks to strengthen its leadership in the semiconductor ecosystem.

Samsung Electronics’ Device Solutions (DS) Division said it has set up an exhibition space under the theme “Architecting AI Systems” at the event, which runs from October 14 to 16 at COEX in Seoul. Through six zones—Next-Generation Technology, Cloud AI, Edge AI, Physical AI, Semiconductor Cluster and Win-Win Cooperation—the company will showcase its technological competitiveness and vision for the semiconductor ecosystem.

Samsung Electronics will highlight its integrated AI semiconductor capabilities, which connect memory, logic design, foundry and advanced packaging. In the memory segment, it will exhibit next-generation high-performance memory for AI, including high-bandwidth memory (HBM) 4E, as well as low-power double data rate (LPDDR)-processing-in-memory (PIM), which integrates computing functions into memory. It will also showcase a zHBM mock-up based on a 3D memory architecture that reduces the physical distance between processors and memory, and a zNAND-O mock-up, a 3D NAND solution optimized for edge AI.

In the foundry segment, the company will exhibit an HBM4E base die made using a 4-nanometer process, “2.3D Cube-E,” an expandable, ultra-high-density packaging solution, “3D Cube-H,” a 3D packaging solution, and a model of an optical interconnect based on co-packaged optics (CPO). In the System LSI segment, it will feature “DIMM Solution,” which integrates key chips for server memory modules; “ISOCELL HPC,” a 200-megapixel premium image sensor; and “Exynos 2600,” a mobile application processor (AP).

The Semiconductor Cluster Zone, newly added this year, will present a detailed roadmap for the Yongin National Industrial Complex, which will serve as a key future production and development hub for Samsung Electronics’ semiconductors. Samsung Electronics plans to invest approximately KRW 360 trillion in the complex, with site preparation and construction set to begin next year and the first production line targeted to start operating in October 2029. Around 70 materials, parts and equipment suppliers and fabless companies are also expected to move into the complex, creating a large-scale semiconductor cluster ecosystem.

The Win-Win Cooperation Zone will showcase the results of 45 years of shared growth since the 1981 founding of Hyupsung Association, a council of partner companies, along with a range of support programs, including financial, technical, staffing and educational support. Samsung Electronics has earned the top grade in the industry’s Shared Growth Index assessment for 14 consecutive years, the only company in the industry to do so. The DS Division plans to hold various partnership events to recognize its suppliers, including “Win-Win Cafe,” which provides coffee trucks at business sites, and “Movie Day” for approximately 30,000 supplier employees and their family members.

This content was produced with the assistance of AI translation services.