LG Electronics, GS E&C and U.S. GRC Push to Standardize "AI Data Center Immersion Cooling"

Validating immersion cooling technology and developing standard designs with GS E&C and GRC
Integrated testing spanning cooling equipment, buildings, piping, and power infrastructure
Strengthening portfolio of air, liquid, and immersion cooling solutions

LG Electronics is partnering with GS E&C and GRC (Green Revolution Cooling), a U.S.-based immersion cooling specialist, to advance immersion cooling technology and develop standard designs for AI data centers.

LG Electronics said on October 14 that it had signed a memorandum of understanding (MOU) with GS E&C and GRC on October 13 at GS E&C's headquarters in Jongno-gu, Seoul. The agreement covers the development of data center immersion cooling technology and related facility technologies, as well as cooperation. Attendees at the signing ceremony included Oh Se-gi, vice president and head of LG Electronics' ES Research Institute; Jo Seong-han, vice president and head of GS E&C's Future Technology Institute; and Choi Dong-hoon, director and head of GRC's Korea office.

Through the collaboration, the three companies plan to verify the practical applicability and reliability of immersion cooling technology for high-performance AI data centers. They will also develop an integrated solution and pursue standardization to support the construction of data centers using immersion cooling solutions.

Immersion cooling is a technology that cools electronic devices, including graphics processing units (GPUs) and central processing units (CPUs), by immersing them directly in a special non-conductive cooling fluid. As power consumption and heat generation at AI data centers increase, immersion cooling is drawing attention as a next-generation cooling method that can complement conventional air cooling and liquid cooling. However, applying it to an actual data center requires comprehensive consideration of not only cooling equipment but also building structures, piping, power infrastructure, and maintenance space.

LG Electronics signed an MOU with GS E&C and U.S.-based GRC on the 13th at GS E&C’s headquarters in Jongno-gu, Seoul, to jointly develop immersion cooling technology for data centers. From left: Oh Segi, executive vice president and head of LG Electronics’ ES Research Center; Cho Seonghan, executive vice president and head of GS E&C’s Future Technology Center; and Choi Donghun, director and head of GRC’s Korea branch. LG Electronics.

The three companies plan to combine their respective technologies and capabilities to improve the suitability of immersion cooling equipment for on-site use and establish standard designs for data center construction. LG Electronics will provide air cooling, liquid cooling, and immersion cooling technologies for AI data centers, along with operating data. Based on this, it plans to build a portfolio of cooling solutions that meet the standard designs.

GS E&C will develop standard building designs for AI data centers and operate a proof-of-concept (PoC) test bed. It will also conduct demonstrations of immersion cooling equipment layout, structural loads, piping, and power connections. GRC will provide immersion tanks and control technology, and help improve system performance using data on equipment installation, operation, and maintenance.

Through this collaboration, LG Electronics plans to verify the performance and reliability of immersion cooling technology and expand its business in cooling solutions tailored to AI data centers. Its strategy is to strengthen its technology portfolio spanning air cooling, liquid cooling, and immersion cooling to address the rapidly growing AI data center cooling market.

LG Electronics offers air cooling solutions based on high-efficiency chillers and fan wall units (FWUs). Chillers produce chilled water, while fan wall units supply cool air and exhaust heat. Its liquid cooling portfolio includes coolant distribution units (CDUs) and cold plates, which directly absorb heat from semiconductor chips.

Oh Se-gi, vice president and head of LG Electronics' Eco Solution (ES) Research Institute, said, "We will continue to research and develop high-performance, high-efficiency cooling solutions to gain an early lead in the rapidly growing AI data center cooling solutions market."

This content was produced with the assistance of AI translation services.