BASF Targets AI Data Center Market, Expands Use of High-Performance Plastics

Global chemical company BASF is expanding the applications of its high-performance plastics, targeting the artificial intelligence (AI) data center and electric vehicle markets. The move is intended to meet growing demands for heat resistance and safety as electronic components become smaller and more highly integrated.

BASF Ultrason® is optimized for electrical and electronic components used in AI infrastructure, including fiber optic connectors (FOCs). BASF

BASF said on October 13 that it is expanding the use of its high-performance thermoplastic Ultrason in electrical and electronic components for data centers, telecommunications equipment, and electric vehicles.

Ultrason is a material that maintains its shape and performance reliably even at high temperatures, and offers excellent electrical insulation and chemical resistance.

One key application is fiber-optic connectors for data centers. Ultrason E can be precision-machined and offers high heat resistance, making it suitable for manufacturing small connectors with complex structures. BASF said it can improve the durability and reliability of components required for high-speed data transmission.

Ultrason is also used for wire coatings and insulation materials. Ultrason P can maintain its electrical insulation performance in high-temperature oil environments of up to 200 degrees Celsius, making it suitable for use as an insulating material for wires in data centers and electric vehicles. It can also be used in cooling-system fan blades and pipe connectors to help improve equipment thermal management and durability.

BASF is also enhancing Ultrason's environmental credentials. Some products are supplied as biomass balance-certified products with a reduced carbon footprint, and BASF also offers Ultrason products that can replace fluorinated materials containing per- and polyfluoroalkyl substances (PFAS) in certain applications.

BASF also plans to shorten product development timelines by supporting customers from component design and material selection through to processing technology.

"The spread of AI infrastructure, advanced telecommunications, and electrification is creating new applications in the electrical and electronics sectors that demand higher performance," said Kazuhiro Kida, who is responsible for business management of BASF Ultrason. "We will continue to develop new Ultrason grades and work with customers around the world to develop suitable material solutions."

This content was produced with the assistance of AI translation services.