"SK hynix's Solidigm Selects Lead Underwriters for U.S. IPO... Listing as Early as Next Year"

Bloomberg: "Goldman Sachs and Morgan Stanley selected"
"Listing next year, company valuation up to $100 billion"
SK hynix: "Considering various options; no decisions finalized"

Bloomberg reported on Oct. 7 (local time) that Solidigm, a subsidiary of SK hynix, had selected lead underwriters for a planned initial public offering (IPO) on the U.S. stock market next year.

According to the report, Solidigm selected Goldman Sachs and Morgan Stanley to lead the offering. Bloomberg estimated that the IPO could raise about $10 billion (approximately 13.4 trillion won). It also reported that a pre-IPO fundraising round for Solidigm, being arranged by the two financial firms, was nearing completion.

JPMorgan Chase, Citigroup and UBS were also selected to participate in Solidigm's IPO, the report said. The listing could take place as early as 2027, and the company's valuation could reach up to $100 billion, it said.

SK hynix headquarters in Icheon, Gyeonggi Province. Yonhap News.

People familiar with the matter said discussions about the listing were ongoing, details could change and additional underwriters could be added.

In response, SK hynix said Solidigm was considering various options to strengthen its business competitiveness, but that no specific plans had been finalized at this time.

Solidigm is a U.S. subsidiary launched by SK hynix in 2021 after it acquired Intel's NAND flash memory and SSD (solid-state drive) businesses. It specializes in high-capacity enterprise SSDs used in AI data centers and cloud services, and is expanding its storage-device business for AI data infrastructure.

This content was produced with the assistance of AI translation services.