SKC Subscribes Additional 92.1 Billion Won in Absolix, Glass Substrate Subsidiary
Accelerating Two-Track Commercialization of Embedding and Non-Embedding Products
Investing 590 Billion Won from First-Half Rights Offering Funds
SKC will make an additional investment in its subsidiary Absolix’s rights offering to ensure stable progress and to accelerate the commercialization of its glass substrate business, a next-generation semiconductor packaging technology.
On the 22nd, SKC announced in a regulatory filing that it plans to make an additional subscription of approximately 92.1 billion won to Absolix’s rights offering. As a result, the total funds SKC has committed to Absolix amount to about 373.1 billion won.
The funds for this investment are sourced from the 1.1671 trillion won raised by SKC through a rights offering in the first half of this year. Of this, SKC had previously stated that roughly 590 billion won would be concentrated into the glass substrate business over the next three years.
Glass substrates, compared to conventional plastic (organic) substrates, feature a flatter surface and more robust resistance to heat and distortion, enabling precision implementation of fine circuits. They offer faster signal transmission and significantly lower power consumption, making them a key component for maximizing the performance of high-bandwidth memory (HBM) and artificial intelligence (AI) semiconductors.
Absolix, which has raised about 400 billion won through this capital increase, will accelerate its two-track strategy to commercialize both embedding (embedded) and non-embedding (non-embedded) products. Sample embedding products produced at its Georgia, USA, plant have successfully passed preliminary evaluations and have now entered reliability assessment. The non-embedding products are also being considered by suppliers in a selection process in the second half of this year, with plans to begin technology proof-of-concept (PoC) within the year. PoC is the stage of demonstrating whether a new technology or product can be commercialized in practice.
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An SKC official stated, "Leveraging SKC’s business execution capabilities, we will steadily proceed with customer certification and commercialization preparations to strengthen our competitiveness in the next-generation artificial intelligence (AI) semiconductor packaging market."
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