ASICLAND Unveils 'AxHub and Mass Production References' at TSMC Forum

ASICLAND will present its self-developed AI-oriented I/O platform AxHub™, ASIC turnkey solution, and silicon reference at TSMC's global OIP (Open Innovation Platform) forum.

According to ASICLAND on September 21, the exhibition booth at this forum will focus on showcasing its ASIC turnkey solution, self-developed AI-oriented I/O platform AxHub™, and silicon references.

The ASIC turnkey solution is a service that comprehensively supports the entire semiconductor development process, spanning from the customer's specification phase through backend design, wafer production, packaging, and mass production testing. With the increasing performance and integration levels of AI and HPC semiconductors leading to greater design complexity and development challenges, ASICLAND provides end-to-end capabilities so that customer companies can manage the entire process efficiently, from product development to mass production.

AxHub™, which has been independently developed by ASICLAND, is a next-generation AI-oriented I/O (Input/Output) platform designed to help global fabless companies shorten development timelines and optimize their designs. This year, TSMC has emphasized reducing design complexity and shortening time-to-market as key directions for OIP. In this context, ASICLAND plans to introduce ways in which AxHub™ boosts the efficiency of developing customers' core functions and supports faster product realization.

At this exhibition, ASICLAND will also unveil an actual chip version of a high-performance semiconductor for which it participated in both the design and mass production process with FADU. By presenting a reference that goes beyond design to actual chip implementation and mass production, the company aims to more intuitively convey its end-to-end project execution experience to global semiconductor stakeholders.

ASICLAND intends to expand technological exchange within the global semiconductor ecosystem and broaden collaboration opportunities with potential customers and partners. In particular, by presenting its proprietary platform, ASIC turnkey solution, and mass production references together, the company plans to highlight its capabilities not only in design technology but also in enabling commercialization and mass production, while seeking opportunities for technical and business cooperation applicable to various global projects in the future.

A representative from ASICLAND stated, "As AI semiconductors become more advanced, it becomes increasingly important to connect complex designs to real products and mass production reliably, not just to adopt advanced processes and packaging," adding, "Through this TSMC OIP forum, we plan to introduce the ASIC design and mass production expertise accumulated by our headquarters in Korea and our proprietary platform capabilities to global customers, and to expand technological exchange with diverse partners in the semiconductor ecosystem."

This content was produced with the assistance of AI translation services.