Simmtech Unveils Next-Generation AI Semiconductor Substrate Technology
Simmtech will showcase next-generation semiconductor substrates and technologies at the International Semiconductor Substrate and Advanced Packaging Expo (KPCA Show 2026).
According to Simmtech on September 9, the company has set its exhibition slogan as "Interconnecting Intelligence, Powering AI." This reflects Simmtech's commitment to connecting AI systems through its advanced semiconductor substrate technologies and providing the essential infrastructure to support AI innovation.
Simmtech plans to present a variety of products and solutions, focusing on high-layer count, ultra-thin, ultra-fine, and large-area semiconductor substrate technologies designed to meet the needs of AI and next-generation computing environments.
Key exhibits include ▲SOCAMM (Small Outline Compression Attached Memory Module) for AI servers, ▲LPCAMM (Low Power Compression Attached Memory Module) as a next-generation low-power memory module, ▲Enterprise SSD Module, and ▲CXL Memory Module.
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A Simmtech representative said, "As the AI semiconductor market grows, the importance of substrate technologies is becoming more significant than ever. Through the KPCA Show 2026, we aim to share Simmtech's next-generation semiconductor substrate technologies and future vision with customers and industry partners, further strengthening our technological leadership in the global market."
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