LG Innotek Unveils FC-BGA for AI Accelerators, Aiming for Mass Production in 2027

Participation in KPCA Show 2026
Showcasing Next-Generation Packaging Technologies
Revealing Glass Substrate Targeted for Mass Production in 2028

LG Innotek is participating in the 'KPCA Show 2026 (International Semiconductor Substrate & Advanced Packaging Industry Exhibition)', held from September 9th to 11th at Songdo Convensia in Incheon, and is unveiling its flip chip ball grid array (FC-BGA) for AI accelerators for the first time.

Marking its 23rd edition this year, the KPCA Show is the largest PCB (Printed Circuit Board) and semiconductor packaging exhibition in Korea, organized by the Korea PCB & Semiconductor Packaging Industries Association (KPCA). More than 350 companies from Korea and overseas are taking part to share the latest technological trends.

At this exhibition, LG Innotek is showcasing innovative products and technologies in areas such as FC-BGA, for which demand is surging in the AI era, along with package substrates and tape substrates.

In particular, the company is debuting its FC-BGA for AI accelerators. FC-BGA is a high-performance semiconductor substrate that connects a semiconductor chip to the mainboard. Since the FC-BGA for AI accelerators is applied to high-performance semiconductors such as GPUs (graphics processing units) and NPUs (neural processing units) that handle large volumes of data at high speed, it needs to house more circuits and components than standard FC-BGA products. As a result, higher circuit density and large-area design technologies are required.

A bird's-eye view of LG Innotek's exhibition booth participating in the 'KPCA Show 2026' held from the 9th to the 11th at Convention Center in Songdo, Incheon. LG Innotek.

The newly unveiled FC-BGA for AI accelerators is a large-area substrate with one side measuring over 100mm. It encompasses LG Innotek's core technologies accumulated over more than 50 years in the substrate business, including advanced microcircuit fabrication and high-layer stacking capabilities. LG Innotek aims to begin mass production of its value-added FC-BGA products for AI training and inference, including AI accelerators, in 2027.

During the exhibition, LG Innotek is also showcasing a large-area FC-BGA substrate measuring 85mm by 85mm, as well as an ultra-large FC-BGA substrate sample with an area approximately 40% larger.

The company is introducing innovative technologies that demonstrate its differentiated competitiveness in FC-BGA. A representative example is chip embedding technology, which, unlike the conventional method of mounting chips on the surface, embeds the chip inside the substrate to minimize the connection distance between the chip and the substrate. This improves signal transmission performance and reduces electric resistance, thereby minimizing power loss.

LG Innotek is also presenting glass substrate technology, a next-generation packaging solution optimized for FC-BGA. Glass substrates replace the core layer inside the substrate with glass, reducing warping and circuit distortion. The company is accelerating its R&D to start mass production of glass substrates in 2028.

LG Innotek’s large-area ‘FC-BGA for AI accelerators’ (right), unveiled for the first time at KPCA Show 2026, is about six times larger than the FC-BGA sample for PCs (left). LG Innotek.

In the package substrate zone, LG Innotek is exhibiting the world's leading RF-SiP (radio frequency system-in-package) substrate, powered by the company's proprietary technology, as well as FC-CSP (flip chip chip scale package) substrates for high-performance memory semiconductors like GDDR (graphics double data rate), whose demand is diversifying as inference-type AI advances.

The company is also presenting the Cu-Post (copper post) process, which has redefined the paradigm for substrates for communication semiconductors. This technology involves building ultra-fine copper posts on the semiconductor substrate and mounting solder balls on top of them to connect the substrate with the mainboard. This allows solder ball spacing to be reduced to about 20% of conventional levels, enabling denser circuitry. Another key advantage is improved heat dissipation, as copper's thermal conductivity is more than seven times higher than that of lead.

In the tape substrate sector, the company is presenting a range of display substrates, including chip-on-film (COF) and 2-Metal COF, as well as 'ECONOVA,' a next-generation smart IC substrate. ECONOVA is the world's first smart IC substrate that achieves high performance using an eco-friendly new material, without the precious metal plating process such as palladium or gold. It is attracting great attention, especially in Europe, by meeting both strict environmental regulations and high product performance requirements.

Jitae Cho, Executive Vice President and Head of LG Innotek's Package Solution Business Division, said, "At this exhibition, visitors can see firsthand how LG Innotek's substrates are used across diverse industries and daily life, such as AI, smartphones, and mobility. We will continue to change the paradigm of the substrate market with our innovative products."

This content was produced with the assistance of AI translation services.