Samsung Electro-Mechanics Advances AI-Era Package Substrates... Unveils 2.5D and Glass Substrates

Samsung Electro-Mechanics Joins KPCA Show
Showcasing Five Technologies Including 2.5D, 2.1D, and Glass Substrates
Expanding Applications to High-Value-Added Substrates

Samsung Electro-Mechanics announced that it will participate in the "KPCA Show 2026" (International Semiconductor Substrate and Advanced Packaging Industry Exhibition) held at Songdo Convensia in Incheon from September 9 to 11, showcasing next-generation semiconductor package substrate technologies, including 2.5D package substrates and glass substrates.

The KPCA Show is a leading domestic exhibition where domestic and international companies in the semiconductor substrate, packaging, materials, and equipment sectors participate to share the latest industry technologies and market trends.

Semiconductor package substrates are key components that connect high-density semiconductor chips to the mainboard, transmitting electrical signals and power. As the performance of semiconductors such as artificial intelligence (AI) accelerators and server CPUs (Central Processing Units) rapidly improves and as high-performance memory adoption expands, the role of package substrates is evolving from simple connectors to core technologies that determine semiconductor performance, power efficiency, and signal stability.

In particular, AI semiconductors that integrate multiple high-performance chips into a single package require advanced technologies for large-area, high-layered substrates, fine circuitry, fine vias and bumps, and high-precision embedding.

At this exhibition, Samsung Electro-Mechanics will introduce next-generation package substrate technologies that encompass a wide range of applications, from AI and servers to data centers, mobile devices, and autonomous vehicles, including: ▲ 2.5D package substrates ▲ 2.1D package substrates ▲ glass substrates ▲ flip-chip ball grid array (FCBGA) substrates for automotive applications ▲ UTCSP (Ultra Thin Chip Scale Package) substrates.

Samsung Electro-Mechanics announced that it will participate in the "KPCA Show 2026" (International Semiconductor Substrate and Advanced Packaging Industry Exhibition) held from the 9th to the 11th at Songdo Convensia in Incheon, showcasing next-generation semiconductor package substrate technologies including 2.5D package substrates and glass substrates. View of Samsung Electro-Mechanics' booth at KPCA Show 2026. Samsung Electro-Mechanics.

With the expansion of generative AI, the computational performance of AI accelerators is increasing, leading to a surge in data input/output (I/O). As a result, substrates are now required to feature large-area, high-layer structures, high circuit density, and the capability to implement large-scale bumps.

Samsung Electro-Mechanics will showcase its core 2.5D package substrate technologies for AI accelerators, including technologies to reduce warpage in large-area, high-layered substrates, achieve high-speed signal transmission, and enable high-density interconnection.

The company is also unveiling its 2.1D package substrate technology, which enables direct chip-to-chip connection without a silicon interposer. Through fine circuitry and high-density interconnection technology, it is strengthening its competitiveness in high-speed, high-density chip connections required for AI semiconductors.

As AI semiconductors become larger and more densely integrated, there is a growing need for substrate technologies that offer higher rigidity and dimensional stability, as well as improved signal, power, and thermal characteristics compared to conventional organic substrate materials.

The glass substrate technology applies glass as the core material to reduce warpage, decrease the number of layers, while still securing excellent signal characteristics and power efficiency.

Samsung Electro-Mechanics Server Flip-Chip Ball Grid Array (FCBGA). Samsung Electro-Mechanics.

At this exhibition, Samsung Electro-Mechanics will present core technologies for glass substrates, such as forming fine connection channels in glass materials and filling them with metal, along with precision surface processing technologies.

Samsung Electro-Mechanics' UTCSP substrate leverages a coreless structure, which reduces substrate thickness, and fine bond finger technology to meet the demands for high integration and slim form factors in data centers and mobile devices.

The company will also display UTC (Ultra Thin Core) package substrates used in CPUs for laptops and tablets, as well as co-package substrates for smartphones.

Automotive package substrates require not just large-area, high-layer structures and the implementation of fine circuitry, but also reliability to withstand high temperatures, high humidity, and repeated temperature fluctuations. Samsung Electro-Mechanics is strengthening its competitiveness in package substrates for autonomous driving by offering advanced substrate technologies, including multi-chip structures and reliability assurance solutions.

Joo Hyuk, Executive Vice President and head of the Package Solution Business Division at Samsung Electro-Mechanics, stated, "As high-performance semiconductor markets such as AI accelerators, servers, and autonomous driving continue to grow, the role and technological complexity of package substrates are rapidly increasing. Samsung Electro-Mechanics will continue to advance large-area, high-layer, ultra-fine circuit technologies and next-generation packaging technologies to respond to the high-end semiconductor package substrate market."

This content was produced with the assistance of AI translation services.