"Boosting AI Chip Performance: Samsung Electro-Mechanics vs. LG Innotek Face Off in Songdo"

September 9-11: Both Firms Exhibit at the KPCA Show

"Original Leader" Samsung Electro-Mechanics Showcases High-End FC-BGA Technologies

LG Innotek Accelerates Portfolio Upgrade with FC-BGA

As the artificial intelligence (AI) semiconductor market experiences rapid growth and next-generation packaging substrate technologies become a key determinant of high-performance chip capabilities, leading Korean substrate companies such as Samsung Electro-Mechanics and LG Innotek are going all out to strengthen their technological competitiveness.

According to industry sources on September 9, the 23rd International Semiconductor Substrate & Advanced Packaging Exhibition (KPCA Show 2026), Korea’s largest expo specializing in semiconductor substrates and advanced packaging, opens for three days from September 9 to 11 at Songdo Convensia in Incheon. This year’s event is expected to become a technological battleground for proving state-of-the-art substrate and packaging technologies, especially in light of the AI semiconductor market’s explosive expansion.

This year’s exhibition is also the largest ever. Not only substrate makers like Samsung Electro-Mechanics, LG Innotek, and Simmtech, but also 355 domestic and global companies, including Hana Micron and StatsChipPac Korea, are participating with approximately 900 booths. This marks a steep growth trend compared to 560 booths from 242 companies in 2024, and 750 booths from 317 companies last year.

An industry insider commented, “Global leading back-end companies such as StatsChipPac and Hana Micron continue to expand their presence with bigger booths. With interest in AI-related demand surging, the exhibition is expected to become even bigger next year.”

The most anticipated technology at this year’s KPCA Show is the flip-chip ball grid array (FC-BGA) used in servers and AI accelerators. FC-BGA is a high-value-added substrate that connects semiconductor chips to the main board via a flip-chip method, enabling high integration and high-speed signal processing performance.

Samsung Electro-Mechanics FC-BGA product image. Samsung Electro-Mechanics

Samsung Electro-Mechanics, the industry leader in Korea, plans to emphasize its technological differentiation by showcasing high-spec FC-BGA substrates for servers and AI accelerators. In particular, the company is highlighting advanced multi-layer, large-area technologies that minimize signal loss and prevent thermal deformation over large surface areas.

The company is also exhibiting its next-generation “game changer” glass substrate, which is still in development. Over the past year, Samsung Electro-Mechanics has methodically pursued commercialization, including signing a memorandum of understanding (MOU) and a formal joint venture agreement with Dongwoo Fine-Chem, a subsidiary of Japan’s Sumitomo Chemical Group. With this in mind, the company aims to present updates on its technology development progress and its more concrete vision at this exhibition.

Sample products of LG Innotek's large-area (left) and ultra-large-area FC-BGA substrates. LG Innotek

LG Innotek, which is accelerating efforts as a later entrant to capture the market, is expected to use this event as a springboard to formally launch its FC-BGA business and strengthen its portfolio. LG Innotek plans to focus on demonstrating its large-area and high-density FC-BGA technologies at this year’s exhibition.

In the field of package substrates, LG Innotek will also showcase its world-leading wireless frequency system-in-package (RF-SiP) substrates and flip-chip chip-scale package (FC-CSP) substrates, alongside FC-BGA. In the tape substrate sector, chip-on-film (COF), 2-metal COF for displays, and next-generation smart IC substrates will also be on display.

An industry source stated, “This year’s KPCA Show will be an opportunity to compare the high-performance substrate technology differentiation and business progress of both companies.”

This content was produced with the assistance of AI translation services.