YMT to Showcase TGV Technology at 'KPCA' Following Taiwan Event

YMT, a company specializing in electronic materials and surface treatment chemical materials, has showcased its flagship process chemical materials and next-generation glass substrate TGV technology at Taiwan's largest semiconductor industry exhibition, and will also participate in the 'KPCA Show 2026'.

YMT participated in 'SEMICON Taiwan 2026,' held from the 2nd to the 4th at the Nangang Exhibition Center (TaiNEX) in Taipei, Taiwan. YMT

On September 7, YMT announced that it will participate in the KPCA Show 2026, which will take place from September 9 to September 11.

'SEMICON Taiwan 2026', held from September 2 to September 4 at the Nangang Exhibition Center (TaiNEX) in Taipei, Taiwan, drew more than 1,300 companies from 65 countries, attracting a wide range of global semiconductor companies.

At this event, YMT introduced its main chemical materials and process technologies, including ▲ chemical copper for T-Glass ▲ etchants and strippers for mSAP and SAP processes ▲ ENEPIG ▲ eco-friendly non-TMAH stripper ▲ wafer cleaner for bumping, among others.

At the 'KPCA Show 2026', to be held from September 9 to 11, YMT plans to present not only its flagship products such as chemical copper for -Glass, chemical materials for mSAP and SAP processes, and ENEPIG, but also its next-generation TGV technology for glass substrates.

Through this, YMT intends to actively promote its technological competitiveness to domestic and overseas customers, aiming to respond to the expansion of advanced packaging markets including AI accelerators and HPC.

An official from YMT stated, "At this week's KPCA Show, we will actively introduce our main chemical materials and TGV technology, and will continue to expand our connections with customers both in Korea and overseas."

This content was produced with the assistance of AI translation services.