ASML Partner Zeiss Says 15-Year Timeline for China’s EUV Lithography Development Is a "Reasonable Assumption" (Comprehensive)
Frank Lomunt, CEO of Zeiss Semiconductor Division
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Zeiss, a key partner of Dutch semiconductor equipment maker ASML, has stated that it is reasonable to estimate that it will take more than 15 years for Chinese companies to develop their own extreme ultraviolet (EUV) lithography equipment technology.
According to Bloomberg News on September 2 (local time), Frank Lomunt, CEO of the semiconductor division at German optics company Zeiss, said in an interview with Bloomberg TV that the projection that it would take China about 15 years to develop its own EUV lithography equipment is a "reasonable assumption." However, he added that it is difficult to quantify the exact pace of China's technological progress.
Zeiss is the sole supplier of optical equipment to ASML, the only company in the world that manufactures EUV lithography machines. EUV equipment is essential for producing cutting-edge semiconductors, such as those used in Nvidia's artificial intelligence (AI) accelerators. Zeiss explained that its parts are used to manufacture about 80% of the world's semiconductors.
Currently, the United States is restricting ASML from exporting its most advanced equipment to China to prevent China from acquiring state-of-the-art AI semiconductors and manufacturing technology. Some high-performance deep ultraviolet (DUV) immersion lithography machines are also subject to export approval. CEO Lomunt stated that he does not believe these export restrictions are having a positive impact, noting that "they actually accelerate innovation in China."
Previously, Swiss investment bank UBS stated in a recent report that it would take China at least 10 more years to have its own EUV technology. In particular, UBS analyzed China's patent activity related to light sources and lasers and found that its technological capability is at a similar stage to where ASML was about 15 years before it began mass-producing EUV equipment. The report also stated that there is a gap in yield and throughput compared to ASML, and that regulatory restrictions remain, making it unlikely that Chinese lithography equipment will be used in overseas markets.
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UBS further predicted that China would secure the capacity to mass-produce immersion DUV lithography equipment within the next 2 to 5 years. While immersion DUV equipment is less advanced than EUV, it is still essential for semiconductor manufacturing. It is used to etch fine and complex circuit patterns onto silicon wafers using light.
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