Next-Generation Semiconductor Packaging Industry Exhibition Opens at Suwon Convention Center on August 26

The "2026 Next-Generation Semiconductor Packaging Industry Exhibition (ASPS 2026)", co-hosted by Gyeonggi Province and Suwon City, opened on August 26 at the Suwon Convention Center.

More than 150 domestic and international companies, including Samsung Electronics and SK hynix, are participating to showcase next-generation technologies such as advanced semiconductor packaging and chiplets. These companies will engage in business exchanges aimed at technological cooperation and market expansion.

Now in its fourth year, the Next-Generation Semiconductor Packaging Industry Exhibition is a specialized event for semiconductor packaging that began in 2023. The exhibition provides a comprehensive overview of the latest technologies and industry trends in advanced packaging—post-manufacturing processes for semiconductors—and chiplets, which are function-specific small chips.

This year’s exhibition, held over three days until August 28, features booths from more than 150 companies, including Samsung Electronics and SK hynix. Notably, these two companies have expanded their exhibition space compared to last year and are presenting not only advanced packaging technologies but also related materials, components, equipment, measurement and inspection technologies, as well as innovations in back-end processes.

During the exhibition period, a variety of programs will be held, including the Semiconductor Packaging Trend Forum (SPTF), the SBJ Materials, Parts, and Equipment Convergence Technology Forum Symposium, technical seminars by participating companies, domestic and international buyer export and procurement meetings, and a semiconductor job fair.

Attendees at the opening ceremony of the Next-Generation Semiconductor Packaging Industry Exhibition are taking a commemorative photo. Courtesy of Gyeonggi Province

The "International Semiconductor Industry Governance Executive Summit (ISIG Executive Summit Korea 2026)" is also being held alongside the exhibition, continuing from last year. The summit runs for two days from August 26 to 27, bringing together about 150 executives, including CEOs of global semiconductor companies, to share insights on next-generation semiconductor technologies and industry strategies, and to discuss business collaboration opportunities.

At the opening ceremony, Hyungcheol Joo, Deputy Governor for Economic Affairs of Gyeonggi Province, stated, "To maintain K-Semiconductor’s global leadership, we must strengthen our competitiveness in advanced packaging technology, which is the new battleground in the global semiconductor race." He added, "Gyeonggi Province will actively support the establishment of a comprehensive semiconductor ecosystem that connects manufacturing companies, fabless, materials, components, equipment, and advanced packaging firms."

Gyeonggi Province has set up a joint pavilion with 24 booths at the venue to promote semiconductor industry development policies and introduce the technologies and products of local companies. Eleven companies—including CNOne, Amitek Korea, MSTech, KC Tech, Anritsu Corporation, Rootsemicon, PetaX, Epsilon, Factorex, Vista Industry, and UBCT—alongside the Next-Generation Convergence Technology Research Institute are participating to expand both domestic and international business opportunities.

Gyeonggi Province aims to develop this exhibition beyond a simple product showcase into a comprehensive business platform that supports technology collaboration, market development, and global network building in the field of advanced packaging.

This content was produced with the assistance of AI translation services.