Gyeonggi Province to Recruit Visitors for Semiconductor Packaging Industry Exhibition Held from August 26-28 Until the 25th

Gyeonggi Province is now recruiting visitors for the ‘2026 Next-Generation Semiconductor Packaging Industry Exhibition (ASPS)’, which will be held at the Suwon Convention Center over three days from August 26 to 28.

The Next-Generation Semiconductor Packaging Industry Exhibition, organized by the local government, is a specialized exhibition focused on semiconductor packaging. It brings together the latest technologies and industry trends in advanced semiconductor packaging and chiplet sectors, running for the fourth consecutive year since 2023. Semiconductor packaging and chiplets refer to the post-processing technologies and designs crucial for continuously enhancing semiconductor performance.

This year’s event will feature 400 booths, with participation from 180 domestic and international companies and organizations. Major semiconductor companies such as Samsung Electronics and SK hynix will take part, along with key local governments that serve as semiconductor industry hubs, including Gyeonggi Province, Suwon, Hwaseong, Yongin, and Icheon.

Notably, Gyeonggi Province Governor Choo Mi-ae will attend the opening ceremony to express the province's commitment to securing a technological edge in the K-semiconductor industry through innovation in advanced semiconductor packaging and to outline directions for supporting companies.

Next-Generation Semiconductor Packaging Industry Exhibition Poster in Gyeonggi Province

During the exhibition, a variety of side events will be held, including the Next-Generation Semiconductor Packaging Exhibition, the Semiconductor Packaging Trend Forum (SPTF), the SBJ Materials, Parts and Equipment Technology Convergence Forum Symposium, technical seminars hosted by participating companies, domestic and international buyer export and procurement consultations, the Semiconductor Job Fair, and buyer docent tours.

The event will also be jointly held with the ‘International Semiconductor Industry Executive Group (ISIG) 2026’, which will bring together around 150 senior executives from global semiconductor companies, further solidifying the scale and status of the exhibition as a global event. The organizers plan to further expand its role as a global business platform for networking between domestic and international semiconductor companies and experts.

Park Minkyeong, Director of the Semiconductor Industry Division, commented, “Advanced packaging is a core technology that determines the competitiveness of artificial intelligence and high-performance semiconductors. We hope this exhibition will provide a substantial opportunity for semiconductor companies in the province to strengthen their technological competitiveness, open new markets, and expand cooperation with global companies.”

Those interested in attending the exhibition can register in advance for free admission on the official website of the ‘2026 Next-Generation Semiconductor Packaging Industry Exhibition’ (www.semipkgshow.com) until August 25.

This content was produced with the assistance of AI translation services.