Hanul Semiconductor Unveils Next-Generation AI Ultrasonic Inspection Strategy... Targeting Full-Scale MLCC Internal Defect Inspection Market

Hanul Semiconductor (320000) announced on August 6 that it held a corporate presentation (IR) for institutional investors on August 5, during which it unveiled its strategy for next-generation post-processing equipment for multilayer ceramic capacitors (MLCC), including an AI-based ultrasonic inspection system and its second-generation mounter.

This online IR event was sponsored by DB Financial Investment. The company provided an overview of its main business operations, the competitive edge of its MLCC post-processing equipment, plans for developing new equipment, and strategies for market expansion, followed by a Q&A session.

The company explained that as demand rises for high-reliability MLCCs used in AI servers, electric vehicles, and autonomous vehicles, inspection technologies are rapidly shifting from a visual inspection-focused approach to methods that can detect internal defects. In response to these market changes, Hanul Semiconductor plans to transition from sample-based inspections to a high-speed, comprehensive inspection system.

To this end, Hanul Semiconductor is developing an AI-powered ultrasonic inspection system capable of non-destructively detecting micro-cracks, delamination, and voids inside MLCCs. The plan is to combine AI interpretation technology with ultrasonic signal analysis, thereby overcoming the limitations of sample-based inspections while improving both speed and accuracy.

The company also highlighted its proprietary deep learning inspection platform, "HaWAIe," as a core strength. This platform can precisely detect micro-cracks, chipping, electrode defects, and foreign substances that are difficult to distinguish through visual inspection or rule-based algorithms. Hanul Semiconductor aims to expand its application not only to visual inspection equipment but also to ultrasonic inspection machines and automated process equipment in the future.

The development of a second-generation mounter to support high value-added MLCC production is also underway. The company presented a goal of increasing production yield and throughput by more than 30% compared to its existing equipment, and expanding its capability to handle ultra-compact MLCCs, especially for automotive and AI server-oriented high-performance MLCC manufacturing.

Hanul Semiconductor is establishing a comprehensive equipment portfolio that covers all aspects of the MLCC post-processing stage, including visual inspectors, characteristic testers, ultrasonic inspection machines, transfer equipment, and mounters. The company emphasized its ability to independently secure precision control, machine vision, and AI technologies, enabling rapid development and supply of customized equipment for clients as a source of competitiveness.

A company representative stated, "The MLCC inspection market is rapidly transitioning from simple visual inspection to a high-speed, full inspection market that can also detect internal defects. By commercializing our AI-based ultrasonic inspection system and our second-generation mounter, we aim to take the lead in the high value-added MLCC equipment market and will continue to expand our domestic and international customer base."

This IR event is meaningful in that it presented a growth strategy centered on targeting the high value-added automotive and AI server MLCC market by leveraging AI-based inspection technology and next-generation MLCC post-processing equipment.

This content was produced with the assistance of AI translation services.