[Conference Call] SK hynix: "HBM4 Mass Production Yield and Quality Approaching Maturity"
On July 29, during its Q2 2026 earnings conference call, SK hynix announced, “We started mass production and supply of HBM4 for key customers from the second quarter of this year. Currently, the mass production yield and quality are already approaching the mature levels seen in the previous generation (HBM3). We are steadily ramping up production capacity to ensure stable supply.” The company added, “Next-generation HBM4E is also proceeding smoothly according to the planned schedule, and we are targeting full-scale mass production in 2027.”
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SK hynix went on to say, “In addition to hybrid bonding, we are developing 'IHBM' technology to effectively address the heat dissipation challenges of next-generation products such as HBM5. IHBM lowers thermal resistance inside the package by more than 30% compared to previous solutions through internal cooling components. We expect this will significantly improve system stability and operational efficiency in high-performance, high-density artificial intelligence (AI) environments.”
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