Inometry Partners with UK UCL to Develop Micro-Crack Detection Technology for Glass Substrates... Selected for Ministry of SMEs and Startups R&D Project

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Inometry, a specialist in advanced industrial non-destructive inspection equipment led by CEO Lee Gabsoo, announced on July 21 that it will embark on a joint development project with University College London (UCL) in the UK, through the Ministry of SMEs and Startups' "2026 Global Collaborative R&D" program, to secure technology for detecting micro-cracks in glass substrates.

The selected project is titled "Development of a High-Resolution X-ray Inspection System for Precise Detection of Micro-Cracks Generated in the Glass Substrate (TGV) Process." Inometry will serve as the lead research and development institution, while UCL, a world-renowned research university in materials engineering and advanced imaging technology, will participate as a joint R&D institution.

The Global Collaborative R&D program is an initiative by the Ministry of SMEs and Startups that supports domestic small and medium-sized enterprises working together with top international research institutes on joint R&D, to help them secure global technological competitiveness and establish a foothold for entry into overseas markets. The research and development period is set for three years, from this month until June 2029, and Inometry will commence full-scale joint R&D with UCL following contractual procedures.

With the recent expansion of the AI semiconductor and high-performance computing (HPC) markets, Through Glass Via (TGV) technology using glass substrates has gained attention as a core technology for next-generation semiconductor packaging. However, due to the characteristics of glass, micro-cracks are likely to form during the through-hole processing stage, so early detection and remediation are crucial for yield and product reliability. This project aims to precisely detect micro-cracks, which are difficult to ascertain through conventional X-ray absorption imaging, by leveraging next-generation imaging techniques in high-resolution X-ray inspection technology.

It is anticipated that securing ultra-precision inspection technology, capable of rapidly locating defects at the micrometer (µm) level using advanced non-destructive inspection equipment, will be a key factor in determining who leads the next-generation semiconductor packaging market.

Following its selection in March for the development of an AI-based glass substrate TGV X-ray/CT inspection system, a national project funded by the Ministry of Trade, Industry and Energy, Inometry plans to continue expanding the scope and precision of its glass substrate inspection technology through this new project.

Inometry is a global leader in secondary battery inspection equipment, supplying its inspection systems to major global cellmakers, including Korea's three largest battery manufacturers. Drawing on its accumulated know-how in X-ray and CT non-destructive inspection and AI-based image analysis, the company is expanding the scope of inspection applications to advanced industries such as glass substrate TGV, next-generation semiconductor packaging, and CPO (Co-Packaged Optics). Recently, Inometry has supplied inspection equipment to a number of TGV-related companies, including JWMT, Extol, and AnyCasting, thereby broadening its business foundation.

Shin Jinwoo, head of the Inspection Technology Center at Inometry and project leader, stated, "Through our joint research with UCL, we will secure next-generation imaging-based X-ray inspection technology that can precisely detect even the most difficult micro-cracks, and strive for its rapid application on actual manufacturing sites." He added, "We plan to apply this technology not only to TGV but also to other ultra-precision semiconductor industries, including advanced semiconductor packaging and CPO (Co-Packaged Optics), to further enhance inspection precision and reinforce our technological competitiveness in the next-generation semiconductor inspection market."

This content was produced with the assistance of AI translation services.