JNTC Signs Agreement with Japan's TOPPAN for TGV Glass Substrate Commercialization... Expands Global Supply Chain

Global advanced materials company JNTC (Co-CEOs Namhyuk Cho and Yoonjung Jang) has signed an agreement with Japanese semiconductor packaging company TOPPAN to commercialize next-generation TGV (Through Glass Via) glass substrates for semiconductors, accelerating its entry into the global market.

On July 13, JNTC announced that it had signed the commercialization agreement for TGV glass substrates with TOPPAN in Japan on July 6. The company explained that this agreement follows its recent success in developing ultra-high-difficulty TGV glass substrates with a glass thickness of 2.0mm. It is significant as it represents collaboration for building a global supply chain and expanding commercialization.

Previously, on June 19, JNTC announced that it had successfully developed TGV glass substrates in a variety of thicknesses ranging from 0.3mm to 2.0mm. Afterwards, the company signed memorandums of understanding (MOUs) and non-disclosure agreements (NDAs) with domestic and international global companies. Now, by signing this commercialization agreement with Japanese semiconductor packaging company TOPPAN, JNTC has once again demonstrated its technological competitiveness.

A company representative stated, "For the first time in the industry, we have secured a wide range of product lines with glass thicknesses from 0.3mm to 2.0mm. The recently developed 2.0mm product is an ultra-high-difficulty new product for artificial intelligence (AI) semiconductor packaging. Unlike the existing industry approach of bonding two 1.0mm glass sheets, it is manufactured using a single 2.0mm monolithic glass substrate."

The representative added, "This product has achieved a mass production yield of about 94%, and has secured core element technologies such as micro-crack elimination, zero voids, and warpage prevention, all of which are considered key challenges in the commercialization of TGV glass substrates. In terms of productivity and price competitiveness, we are also receiving high evaluations from a variety of customers."

JNTC stated that since officially entering the semiconductor glass substrate business in 2024, it has completed vertical integration of the entire TGV glass substrate production process within about two years, and has expanded collaboration with multiple global companies up to the commercialization stage based on this integration.

The company attributes these achievements to the in-house development of core technologies: 40 years of Jinwoo Engineering’s equipment manufacturing know-how, 30 years of plating technology accumulated through the connector business, and over 20 years of expertise in laser, etching, and cutting technologies acquired from the strengthened glass business.

Namhyuk Cho, CEO of JNTC, said, "We are currently conducting a variety of projects and evaluations targeting mass production in 2027, in partnership with top-tier global integrated semiconductor companies as well as advanced semiconductor packaging companies in China, Japan, Europe, and Korea. In response to the high-level, customized product demand from global clients, we strategically plan to expand our mass production lines domestically, rather than in Vietnam."

He added, "With the recently acquired technologies for developing and manufacturing 2.0mm glass, we will focus our capabilities on leading the global glass substrate market and driving the standardization of technology."

This agreement is expected to serve as a turning point for JNTC, enabling the company to expand its global semiconductor packaging supply chain and enter the full-scale commercialization stage, based on its proprietary TGV glass substrate technology.

This content was produced with the assistance of AI translation services.