TomoCube Launches Desktop Holotomography System for Defect Analysis in Semiconductor Glass Substrates

TomoCube, a specialist in 3D non-destructive inspection and metrology (CEO Park Yonggeun), officially launched the 'HT-T1 Desktop (HT-T1D)' desktop holotomography (HT) system on July 13. This system enables precise analysis of defect causes in glass substrates, which are a core material for next-generation semiconductor packaging.

The HT-T1D is a device specialized for glass substrate inspection and metrology. Based on defect coordinates detected by existing inline inspection equipment such as automated optical inspection (AOI), it reconstructs the internal structure of the specified area as non-destructive 3D data. This allows precise confirmation not only of the location and shape of defects, but also of their properties in the depth direction. The system is designed to provide information necessary for analyzing the process and causes of defects that are difficult to identify with surface inspection alone.

Recently, the importance of glass core substrates and glass interposers has been rising in the AI accelerator and high-bandwidth memory (HBM) packaging markets. However, swiftly identifying the causes of micro-defects that occur in various processes—such as laser processing, etching, metallization, and singulation—and stabilizing yield remain major challenges for commercialization. With conventional surface inspection methods alone, it is difficult to determine in which process a defect occurred. In the event of a critical defect, the entire unit must be discarded, making it essential to link inspection data to process improvements as quickly as possible. As a result, 'yield learning speed' is emerging as a key factor for productivity.

TomoCube has applied visible-light-based holotomography technology to the HT-T1D, enabling visualization of the three-dimensional refractive index distribution inside glass with a precision of one ten-thousandth. Since the method is non-destructive, the same location can be measured repeatedly at each process stage, making it possible to track when defects are created or expanded. The company expects this to reduce the time required for root cause analysis of defects—which previously took several days to weeks using destructive analysis methods—to within a few minutes, and to enable proactive responses before costly subsequent processes.

Alongside the new equipment, TomoCube has also released 'TomoAnalysis MI (TAMI)', a dedicated 3D analysis software. TAMI quantitatively analyzes three-dimensional refractive index volume data and provides it in report format as dedicated inspection and metrology software. The company explains that the data from the inline module 'HT-T1M', which is scheduled to be applied to mass production lines through system integration (SI) partners in the future, can also be analyzed in the same format, allowing a unified workflow from research and development (R&D) to mass production review.

Park Yonggeun, CEO of TomoCube, stated, "Although glass substrates are in the spotlight as a core material for next-generation packaging, mass production competitiveness depends on how quickly defects can be understood and linked to process improvements. HT-T1D is not just for simple defect detection—it will be an essential metrology platform for pinpointing fundamental defect causes and innovating process conditions." He added, "Since refractive index itself determines device performance, the same platform can be applied to glass photonic integrated substrates for co-packaged optics (CPO). Thus, it can be used not only for defect analysis but also in fields where functional metrology is required."

TomoCube plans to use the launch of the HT-T1D as an opportunity to expand cooperation with glass substrate manufacturers, advanced packaging companies, and SI partners, supporting defect cause analysis, process review, and yield learning workflow establishment. In addition, considering the potential for inline application through SI partners in the future, the company will continue to expand its glass substrate inspection and metrology portfolio and respond to increasing demand for defect analysis and yield learning in the advanced semiconductor packaging market.

This content was produced with the assistance of AI translation services.