SK hynix Demonstrates Full-Stack AI Memory Capabilities at US HPED Conference
SK hynix announced on June 19 that it showcased a wide range of memory products for artificial intelligence (AI) infrastructure, including High Bandwidth Memory (HBM) and server DRAM, at the US information technology (IT) exhibition 'HPE Discover 2026' (hereinafter HPED).
HPED is a global technology conference held annually by the US data center server specialist Hewlett Packard Enterprise (HPE). This year’s event took place over four days from June 15 to 18 (local time) at the Venetian Convention Center in Las Vegas, United States.
Booth scene of SK hynix at the U.S. information technology (IT) exhibition 'HPE Discover 2026' (hereinafter HPED). SK hynix Newsroom
View original imageAt its exhibition booth, SK hynix demonstrated its partnership by displaying models of NVIDIA's next-generation AI platform 'Vera Rubin' alongside its HBM4 (6th generation) and HBM3E (5th generation) products. In addition, SK hynix introduced a portfolio of memory solutions for AI infrastructure, including server DRAM, enterprise SSDs (eSSD), and CXL Memory Modules (CMM)–DDR5.
SK hynix also symbolically highlighted the close collaboration between the two companies by exhibiting actual SK hynix products installed in HPE server systems. SK hynix has completed certification and is currently supplying HPE with its data center eSSD 'PS1010 E3.S,' based on 176-layer 4D NAND, and its '64GB DDR5 RDIMM' server DRAM, which is the world’s first to use 10-nanometer-class (1c) 6th generation process technology for improved processing speed and power efficiency.
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SK hynix stated, "Through HPED 2026, we have further solidified our partnerships with HPE and other global partners, focusing on broadly promoting the technological capabilities that SK hynix can provide across the AI infrastructure sector. Moving forward, as a 'full stack AI memory creator,' we will continue to expand our role in AI infrastructure together with our partners."
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