INOX Advanced Materials Sees Five Consecutive Quarters of Growth in Semiconductor Packaging Material Sales Share

INOX Advanced Materials announced on June 15 that the sales proportion of memory semiconductor packaging materials has increased for five consecutive quarters.

The quarterly sales share showed an upward trend, rising from 6.6% in the first quarter of last year, to 7.4% in the second quarter, 8.2% in the third quarter, and 8.3% in the fourth quarter, reaching 9.9% in the first quarter of this year.

The growth is expected to accelerate further based on new orders. INOX Advanced Materials has completed approval and secured orders for specialized 20㎛ DAF products for low-power DRAM (LPDDR) targeting global top-tier semiconductor manufacturers, and has begun full-scale mass production. DAF is a film material used in the semiconductor packaging process to precisely attach chips and substrates, helping to maintain the stability of memory chips and improve thermal performance.

INOX Advanced Materials is also focusing on the development of 'build-up film,' which is attracting attention as a next-generation core semiconductor material, based on its accumulated expertise in material design and advanced compounding technology through in-house research and development (R&D) capabilities.

A company official stated, "We are doing our best to ensure that build-up film can be applied to our global clients' products through continuous technological exchanges," and added, "We have designated core materials required for physical AI as future growth drivers for the company, and are focusing on strengthening our organization and R&D capabilities."

This content was produced with the assistance of AI translation services.