Showcasing High-Performance Power Semiconductor Materials for AI Data Centers

KCC participated in Europe's largest power semiconductor exhibition, showcasing ceramic substrates, EMC, silicone materials, and more.


KCC exhibition booth set up at PCIM 2026 held in Nuremberg, Germany. KCC

KCC exhibition booth set up at PCIM 2026 held in Nuremberg, Germany. KCC

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KCC announced on June 12 that it exhibited core materials for power semiconductors and engaged in technology exchanges with global customers at "PCIM 2026 (PCIM Expo & Conference 2026)," held in Nuremberg, Germany from June 9 to 11.


PCIM is the largest power semiconductor exhibition in Europe, presenting the latest technologies and solutions in the fields of power electronics, intelligent motion, renewable energy, and energy management. This year, the areas of application for power semiconductor materials, which had previously focused on electric vehicles, expanded to include AI data centers. The exhibition emphasized the ability to respond to new demand driven by the spread of AI infrastructure.


Momentive, a global silicone material company and subsidiary of KCC, also participated in this exhibition. The two companies jointly presented integrated solutions featuring ceramic substrates, EMC, and silicone materials used in power semiconductors and power modules.


KCC introduced the highly reliable AMB (Active Metal Brazing) ceramic substrate as a representative exhibit. The AMB substrate enhances the bonding strength between copper circuits and ceramics, resulting in excellent thermal conductivity and mechanical strength. It is regarded as an optimal solution for inverters in electric vehicles and high-output power modules.


The company also introduced DCB (Direct Copper Bonding) substrates suitable for industrial power modules, high heat-resistant epoxy encapsulants (High Tg), and the newly unveiled LMC (Liquid Molding Compound), all of which are power semiconductor packaging materials.


Momentive showcased a variety of high-performance silicone materials applicable across the power semiconductor and electric vehicle industries, including silicone gels for power modules. Its silicone solutions, which simultaneously provide heat dissipation, insulation, and protection functions, attracted significant attention.


KCC achieved notable results in expanding its contact points with global customers through this exhibition. Representatives from global semiconductor and automotive electronics component companies visited the booth to examine technologies for power semiconductor materials and discussed potential product applications and technology cooperation. The ability of KCC and Momentive to provide integrated solutions for ceramic substrates, EMC, and silicone materials was highlighted as a key differentiator.



A KCC representative stated, "PCIM 2026 provided an effective platform to showcase KCC's power semiconductor material technology and Momentive's competitive silicone solutions to global customers," adding, "We will continue to expand our material solutions to meet the growing demand for high-performance power semiconductors, especially in electric vehicles and AI data centers."


This content was produced with the assistance of AI translation services.

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