SK hynix Places 44.2 Billion Won Order for HBM4 TC Bonders with Hanmi Semiconductor

To Be Installed at SK hynix Cheongju Back-End Facility
Estimated 15 Units of Equipment Ordered
Featured in Nvidia's "Vera Rubin"

On June 8, Hanmi Semiconductor announced in a regulatory filing that it has received an order from SK hynix for its "TC Bonder 4.5 Griffin" equipment, used in the manufacturing of sixth-generation high bandwidth memory (HBM4).

The contract is valued at 44.2 billion won, and the contract period runs from today until September 2.

Given that the price of one TC Bonder is around 3 billion won, it is estimated that SK hynix will be bringing in approximately 15 units.

The TC Bonder 4.5 Griffin is an upgraded version of the "TC Bonder 4" that Hanmi Semiconductor announced in May last year, and it is known to be optimized for SK hynix.

Hanmi Semiconductor Cheongju Office. Hanmi Semiconductor.

This equipment is expected to be installed at SK hynix's Cheongju back-end processing facility.

With SK hynix adopting the TC Bonder, which is essential for manufacturing HBM4, industry watchers expect the company to accelerate the productivity increase for HBM4.

SK hynix has been in mass production of HBM4 since September last year. HBM4 will be installed in Nvidia's next-generation AI accelerator, "Vera Rubin."

Meanwhile, Nvidia is urging SK hynix to further expand its HBM production capacity.

On June 5, Nvidia CEO Jensen Huang stated at Gimpo Airport that, regarding quality testing of HBM4 suppliers, "Certification has been completed for all three companies—Samsung Electronics, SK hynix, and Micron Technology in the United States—and mass production is currently underway."

This content was produced with the assistance of AI translation services.