Chairman Chey Tae-won Meets TSMC Chairman C.C. Wei: "Strengthening Global AI Alliance"
First Meeting in Two Years Since 2024
Collaboration on Next-Generation HBM Development and Advanced Packaging
Chey Tae-won, Chairman of SK Group, held a surprise meeting with C.C. Wei, Chairman of TSMC, the world’s largest foundry (semiconductor contract manufacturing) company. This move is seen as an effort to strengthen the global artificial intelligence (AI) semiconductor alliance.
Chairman Chey Tae-won of SK Group (left) is taking a commemorative photo with C.C. Wei, Chairman of TSMC, during their meeting in Taiwan on the 3rd. SK hynix
View original imageAccording to the official SK hynix newsroom on June 4, Chairman Chey met with Chairman Wei in Taiwan the previous day to share insights on next-generation AI technology trends and to hold in-depth discussions on strategies for leading the future AI ecosystem, based on the strong partnership between the two companies.
This meeting was the first in two years since June 2024, and the industry views it as an opportunity to reaffirm the deep trust between the two companies. During this meeting, both companies agreed to further strengthen their comprehensive collaboration, including the development of next-generation high-bandwidth memory (HBM) and advanced packaging, in order to respond swiftly to changes in the global AI market environment.
In particular, as resolving supply bottlenecks within the global AI value chain has emerged as a key challenge, the combination of SK hynix’s industry-leading AI memory technology and TSMC’s foundry capabilities is expected to offer a practical solution to this issue.
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The two companies plan to accelerate their efforts to secure leadership in the 'customized AI memory' market, tailored to the diverse needs of global big tech companies. SK hynix stated, "Through our solid partnership with TSMC, we will continue to strengthen our market leadership by delivering the highest-performing products required in the AI era in a timely manner."
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