LG Innotek Unveils Large-Area FC-BGA at Global Semiconductor Packaging Conference

First Appearance at '2026 ECTC'
135 Leading Global Semiconductor Companies Gather
Showcasing Large-Area FC-BGA Substrates for AI and More

LG Innotek announced on May 27 that it will showcase next-generation semiconductor substrate technology at the 2026 ECTC (Electronic Components and Technology Conference).

Now in its 76th year, ECTC is the world's largest international conference in the field of semiconductor packaging, hosted by the IEEE (Institute of Electrical and Electronics Engineers) in the United States. The event runs for four days from May 26 to May 29 (local time) in Orlando, Florida.

Two types of large-area Flip Chip Ball Grid Array (FC-BGA) substrate sample products from LG Innotek. LG Innotek

This year, the conference is expected to be attended by over 2,000 industry professionals from more than 20 countries and 135 leading global semiconductor companies, including Intel and IBM, who will share the latest trends in semiconductor packaging technology.

Participating in the ECTC for the first time, LG Innotek has set up its own exhibition booth during the event, where it will introduce two sample products of large-area flip chip ball grid array (FC-BGA) substrates currently under development, along with the differentiated technologies applied to these products, to its global big tech clients.

With the rapid expansion of both training and inference artificial intelligence (AI) and the surge in token (the basic unit of AI computation) usage by AI agents, the performance requirements for semiconductor chips are becoming increasingly sophisticated. To process large volumes of data at high speed, high-end semiconductor chips require more circuits and components to be mounted on the substrate. As a result, the number of layers and circuit density of FC-BGA substrates are increasing, and their area is inevitably expanding.

In response, LG Innotek is presenting not only a large-area FC-BGA substrate measuring 85mm by 85mm at this year’s ECTC, but also an ultra-large-area FC-BGA substrate sample with an area approximately 40% larger. Unlike conventional methods where chips are mounted on the surface, these large-area FC-BGA substrates employ embedding technology that incorporates the chip within the substrate itself. This shortens the signal transmission distance and reduces electrical resistance during power supply by about 25%, thereby helping to lower server power loss and improve power efficiency.

LG Innotek also plans to display its 5G communication RF-SiP substrate, which embodies more than 50 years of proprietary technological expertise. This product features the world's first application of the copper post (Cu-Post) method, which has revolutionized the paradigm of communication semiconductor substrate technology and has attracted significant attention within the industry.

George Tae Cho, Head of the Package Solution Business Division, stated, "ECTC is expected to be a key opportunity for LG Innotek to promote its next-generation substrate technology competitiveness to global customers and expand new partnerships and business opportunities. By leading with high-value-added semiconductor substrates that are in strong demand worldwide, we intend to grow the package solution business into a core business worth more than 3 trillion won by 2030."

This content was produced with the assistance of AI translation services.