Korea Advanced Materials Introduces Ultra-High-Speed Semiconductor Interconnect Technology from ETRI... Accelerates Optical Communications Expansion

Korea Advanced Materials, a company specializing in optical communications, has begun securing core technologies to support ultra-high-speed data transmission environments.

On April 3, Korea Advanced Materials announced that it had signed a technology transfer agreement with the Electronics and Telecommunications Research Institute (ETRI) for "impedance matching silicon interposer technology for 200Gbps ultra-high-speed signal transmission."

This technology focuses on precisely designing the connection structure between semiconductor components to stably deliver electrical signals in ultra-high-speed environments. In particular, in environments such as data centers, where large volumes of data must be processed at high speed, the quality of chip-to-chip connections directly affects signal loss and speed reduction, which means that highly reliable connection technology is becoming increasingly important.

The recently transferred technology is the result of ETRI’s development of optical component technology for 1.6Tbps-class optical transceivers used for intra-DC communications. Based on a 200Gbps-class high-speed signal architecture, it is expected to be a key technology that will determine the competitiveness of next-generation optical communication equipment, as it can be expanded to support 800Gbps and 1.6Tbps-class optical modules in the future.

With the spread of AI services rapidly increasing data center traffic, demand for high-speed, high-capacity data transmission technology is also rising quickly. According to LightCounting 2024, a market research firm, the market for data center optical transceivers is projected to grow from approximately 5 billion dollars in 2023 to about 30 billion dollars (about 45.192 trillion won) by 2030.

Korea Advanced Materials plans to use this technology acquisition as an opportunity to expand its business areas into next-generation optical modules and high-speed packaging. The company aims to strengthen its business portfolio centered on ultra-high-speed interconnects and packaging by generating synergy with its accumulated silica PLC, silicon photonics, and optical packaging technologies.

A company official stated, "This technology transfer is significant in that it provides a foundation to respond to AI data centers and ultra-high-speed optical communication environments," adding, "We will gradually pursue the development of related products by combining this with our existing optical component technologies."

This content was produced with the assistance of AI translation services.