[Click eStock] "OE Solutions Secures Patents for the CPO Era... Establishes Foothold for Entry into AI Data Centers"

On March 25, Meritz Securities analyzed that OE Solutions is accelerating its response to the CPO (Co-Packaged Optics) market, which has emerged as a core technology for next-generation AI data centers. As securing external light sources has become a key challenge, the company is strengthening its technological competitiveness by obtaining related patents and unveiling high-speed optical transceivers and external light source modules.

Jisoo Jeong, a researcher at Meritz Securities, highlighted the importance of "securing external light sources, which are essential for the implementation of CPO." In fact, Nvidia recently invested 2 billion dollars each in Coherent and Lumentum, securing long-term purchase agreements and production CAPA priority for InP-based high-power lasers and modules. As GPU performance has improved dramatically, the bandwidth and power efficiency demands of network interconnects are reaching their physical limits. As a result, the transition to CPO technology is accelerating.

Researcher Jeong explained, "With the expansion of GPU computing power, the demand for network interconnect bandwidth and power efficiency requirements are reaching physical limits, which is accelerating the transition to CPO technology." He added, "However, for the implementation of CPO, a stable supply of external light sources (ELS) is essential."

Amidst this trend, OE Solutions unveiled a 1.6Tbps OSFP optical transceiver for AI data centers and an ELSFP (External Laser Source Form-Factor Pluggable) module for CPO at OFC 2026, the world's largest optical communication exhibition, held in Los Angeles, United States, from March 17 to March 19. In particular, the 1.6Tbps optical transceiver has demonstrated compatibility with InfiniBand switches for AI data centers through internal testing, and the ELSFP optical module is scheduled to be supplied as samples to global customers starting in the third quarter.

Another pillar of technological competitiveness is the recently secured patent. The “Optical Plug Connection Package” patent, disclosed on March 16, presents a structure that solves alignment issues arising in the process of connecting semiconductor chips and optical fibers on an interposer substrate. The traditional flip-chip method had limitations in confirming waveguide alignment, but by applying an undercut structure to the interposer substrate, the chip's waveguide can be precisely matched.

Based on this patent, OE Solutions plans to target the next-generation optical network market by combining its experience in developing coherent optical engines using Hybrid InP/SOI PIC technology and high-speed optical transceivers based on silicon photonics. The industry sees that, as external light source and packaging technologies have become key variables for CPO commercialization, OE Solutions' proactive acquisition of these technologies could lead to mid- to long-term competitiveness.

This content was produced with the assistance of AI translation services.