[Conference Call] Samsung Electronics: "All HBM Capacity Sold Out... Sales Expected to Triple This Year"

On October 22 last year, the actual HBM4 and HBM3E, sixth-generation high-bandwidth memory, were exhibited at the Samsung Electronics booth set up at 'Semiconductor Exhibition (SEDEX) 2025' held at COEX in Gangnam-gu, Seoul. Photo by Yonhap News.

On January 29, during the 2025 Q4 earnings conference call, Samsung Electronics stated, "We have secured purchase orders (PO) from major clients for the entire production capacity currently available for high-bandwidth memory (HBM). We expect our HBM sales in 2026 to improve significantly, increasing more than threefold compared to the previous year."

The company added, "What is noteworthy is that despite our efforts to expand supply, demand for HBM from major clients in 2026 is already exceeding our planned supply capacity. In the short term, we are strengthening our ability to respond to demand for HBM3E, while also actively investing in securing 1c-nanometer process-based capacity for HBM4 and HBM4E."

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