[Market Focus] LaserCell Surges on News of Advanced Packaging Joint Development with Taiwanese Foundry View original image

LaserCell is showing strong performance. This is believed to be influenced by news that the company is expanding its joint development project on semiconductor back-end process (OSAT) with the world's largest foundry company in Taiwan.


As of 10:23 a.m. on November 26, LaserCell is trading at 2,575 won, up 19.77% from the previous day.


LaserCell is conducting quality tests for its major laser bonding systems with its clients, including large-area glass panel laser bonding (LSR_300PLP), probe card laser bonding (LPB), and large-area FCBGA laser bonding (eLMB).


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As global demand for artificial intelligence (AI) and high-performance computing (HPC) semiconductor packaging increases, Taiwanese clients are considering adopting laser-based localized heating and micro-bonding technologies. As a result, the application scope of LaserCell's surface laser technology is expanding significantly.


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