[Special Stock] NineTech Secures Next-Gen AI Chip Technology for Samsung and TSMC... Also Leads in Glass Substrate
Ninetech is showing strong performance. The news that it has secured next-generation glass substrate semiconductor technology and is commercializing it seems to be influencing its stock price.
As of 10:01 AM on the 11th, Ninetech was trading at 2,755 KRW, up 435 KRW (18.75%) from the previous trading day.
Ninetech, a company specializing in secondary battery and semiconductor equipment, announced earlier this month that it has completed the development and testing of technology for producing fan-out panel level packaging (FO-PLP) and glass substrate equipment.
FO-PLP is equipment that uses larger panels than the existing wafer level packaging (WLP), allowing more semiconductor chips to be packaged simultaneously. It is attracting attention as next-generation semiconductor technology such as glass substrates and silicon photonics. Both Samsung Electronics and TSMC have decided to adopt FO-PLP technology for AI semiconductor production in their next roadmaps. Among them, TSMC is trying to solve production capacity limits and cost issues of AI semiconductor packaging for companies like Nvidia by applying the FO-PLP method and glass substrates.
On the same day, Lee Seok-ju, president of Ninetech, said in an interview with an economic newspaper, "We have also secured technology for glass through-via wet etching (TGV Wet Etching) process equipment through pilot equipment production." This technology is known to be for the interposer process to form electrodes on glass substrates and the cavity process to insert multilayer ceramic capacitors (MLCC) and others into the substrate.
He added, "Over the past three years, we have built related technological capabilities by supplying all wet equipment applied to 'FO-PLP' to overseas semiconductor companies and glass core substrate companies."
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He said, "Through full-scale research and development investment, we will strive to lead the market and ensure that Ninetech is at the forefront when glass substrates are fully commercialized."
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