[Special Stock] LaserCell Introduces Laser Debonding Technology for Samsung·SK HBM... Patent Ownership Highlighted↑

Razer Cell is showing strength. It is interpreted that this is influenced by news that Samsung Electronics and SK Hynix will introduce laser technology in the wafer process for high bandwidth memory (HBM).

As of 10:46 AM on the 9th, Razer Cell is trading at 10,080 KRW, up 8.04% compared to the previous day.

According to the industry, Samsung Electronics and SK Hynix are reportedly preparing to switch the wafer debonding process for HBM to a laser method. Wafer debonding is the process of separating a temporary wafer (glass material carrier wafer) attached to prevent the thinned wafer from bending during processing.

Wafer debonding has been carried out using a component called a blade. It is called mechanical debonding because the main wafer where the semiconductor is made and the carrier wafer are bonded with adhesive and then separated with a blade.

However, in the case of HBM, as the number of stacked layers increases to 12 or 16, the wafer becomes thinner, facing limitations in separation using a blade. The wafer becomes thinner than 30 micrometers (㎛), raising concerns about damage. The increase in processes such as etching, polishing, and wiring for circuit engraving, and the need for new adhesives due to ultra-high temperature environments are also reasons why the two companies want to use lasers instead of the existing mechanical method.

Meanwhile, Razer Cell is a company whose main business is manufacturing equipment necessary for the packaging process of chips and PCB substrates based on ‘planar light source-area laser’ technology. It holds patents such as ‘multi-beam laser debonding apparatus and method.’

This content was produced with the assistance of AI translation services.