[Peace&Chips] 'Only HBM?'... Eyes on Next-Generation Memory 'MRDIMM'

Bandwidth Doubled Compared to Existing DRAM Modules
Advantages in Data Processing Growing in the AI Era
Samsung Electronics and SK Hynix Prepare to Pioneer the Market

A keyword that frequently appears in discussions about the recent memory semiconductor market is High Bandwidth Memory (HBM). Just 2 to 3 years ago, HBM was not a product that received this much attention. However, since last year, it has gained rapid recognition due to the AI effect. The success of HBM has caused memory companies to experience mixed fortunes, which makes one realize how formidable technological changes can be.

As a result, the memory industry is putting great effort into finding next-generation memory. They are on the hunt for the second HBM. With the expansion of AI, memory also requires rapid evolution, increasing the importance of research and development. In this process, Samsung Electronics and SK Hynix have identified several products as next-generation memory, one of which is 'MRDIMM.'

Samsung Electronics MRDIMM image / [Image source=Samsung Semiconductor Newsroom]

MRDIMM stands for 'Multi-Ranked Buffered Dual In-Line Memory Module.' A module that mounts multiple DRAM chips on a substrate is called a DIMM, and MRDIMM is a type of DIMM designed to increase data transfer speed compared to existing DRAM modules, enabling use in servers and data centers that handle large-scale data.

MRDIMM operates two 'ranks,' which are the basic data transfer unit bundles sent from the DRAM module to the central processing unit (CPU), simultaneously, doubling the memory bandwidth (the width of the data transfer channel). Compared to the previous method where only one rank operated, it can process a larger amount of data at once. To enable this, a special buffer component that supports signal transmission between DRAM and CPU must be mounted on the module.

Infographic provided by SK Hynix during the development of MRDIMM in 2022 / [Image source=SK Hynix Newsroom]

Samsung Electronics and SK Hynix have developed MRDIMM. Samsung Electronics verified product performance with major chipset companies in the second half of last year, and recently, they have been conducting sampling tests by sending MRDIMM samples with improved performance, capacity, and power efficiency to customers. Earlier this year, they also announced plans to introduce MRDIMM using 32-gigabit (Gb) Double Data Rate (DDR)5 DRAM in the future.

SK Hynix announced in 2022 that it succeeded in developing MRDIMM samples in collaboration with Intel in the United States and Renesas in Japan. In November last year, at 'Supercomputing 2023' held in the United States, they showcased MRDIMM achieving a maximum data processing speed of 8800 megabits (Mb) per second, attracting attention. "This is a leap in performance achieved through a new approach unlike anything before," explained the product development team.

Editor's NoteSemiconductors, often called the rice of modern industry. Although we hear the term daily, it’s hard to explain when asked. Peace & Chips will make the complex concepts of semiconductors and the overall industry flow easy to digest for you. Just put your spoon down and enjoy.

This content was produced with the assistance of AI translation services.