[Special Stock] Hanmi Semiconductor Rises on Expectations of Increased Demand for HBM TC Bonder

Hanmi Semiconductor is showing strong performance. It appears that securities firms' analysis, which expects benefits from aggressive capacity expansion of high-bandwidth memory (HBM) facilities and an increase in the number of stacks by memory companies, has influenced this trend.

As of 10:42 AM on the 29th, Hanmi Semiconductor was trading at 170,900 KRW, up 7,900 KRW (4.85%) from the previous trading day.

Lee Surim, a researcher at DS Investment & Securities, stated, "Hanmi Semiconductor's TC bonder sales are expected to increase significantly from about 10 billion KRW last year to over 300 billion KRW this year, driven by orders from SK Hynix and Micron. Considering the possibility of expanding additional customers, the company's total sales next year are expected to exceed 800 billion KRW."

Additionally, continued benefits in the HBM TC bonder market are anticipated. Lee Surim explained, "HBM4 requires 16-layer stacking at a height of 720μm, making the introduction of hybrid bonding inevitable. However, with JEDEC relaxing the stacking height to 775μm, it is highly likely that the TC bonding method, which has higher yield and lower cost compared to hybrid bonding, will be maintained."

She added, "Hanmi Semiconductor, which holds about 65% or more of the entire HBM TC bonder market share, will continue to benefit. Ultimately, evolution to the hybrid bonding method is inevitable to achieve higher stack counts and lower heights."

This content was produced with the assistance of AI translation services.