[Featured Stock] Top Engineering Develops Glass Substrate Laser Cutting Technology to Shorten Process... LaserApps Stake Spotlighted↑

Top Engineering is showing strong performance. This is interpreted as being influenced by the news that its affiliate, LaserApps, has developed high-strength laser cutting equipment for advanced semiconductor glass substrates.

As of 9:50 AM on the 1st, Top Engineering is trading at 6,900 KRW, up 12.93% compared to the previous day.

According to industry sources, LaserApps announced the day before that it has developed high-strength laser cutting equipment for advanced semiconductor glass substrates. This technology uses a femtosecond laser to create a plasma melting spot inside the glass to cut it, differentiating itself from existing mechanical cutting (wheel) or carbon dioxide (CO₂) and Bessel laser methods with LaserApps' proprietary technology.

The existing cutting technology for semiconductor glass substrates causes micro-cracks inside the glass due to external forces such as pressure. In contrast, LaserApps generates a melting point on the glass edge to form a smooth cutting surface. Since there are no micro-cracks, no post-processing is required. From the perspective of semiconductor glass substrate manufacturers, this can reduce some process steps such as polishing, thereby increasing productivity.

LaserApps is reportedly discussing equipment supply with domestic and international semiconductor glass substrate manufacturers. Currently, they are conducting technology evaluations and reliability tests by cutting glass wafers from substrate companies. Delivery is targeted for next year.

Meanwhile, as of the end of last year, Top Engineering holds a 30.49% stake in LaserApps.

This content was produced with the assistance of AI translation services.